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  1. Cpu Maker
    Qualcomm
  2. Mass Storage
    onboard eMMC
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Opzioni
Cpu Maker
  1. Intel 9 elementi
  2. MediaTek 6 elementi
  3. NXP 15 elementi
  4. Qualcomm 7 elementi
  5. Rockchip 1 elemento
Cpu Type
  1. NXP i.MX 93 1 elemento
  2. Qualcomm® QCS5430 1 elemento
  3. Qualcomm® QCS6490 3 elementi
  4. Qualcomm Dragonwing IQ-2390 1 elemento
  5. Qualcomm Dragonwing IQ-2390 1 elemento
Ethernet
  1. ETHERNET≥1 6 elementi
  2. ETHERNET≥2 3 elementi
Form Factor
  1. SMARC 2 elementi
  2. Boxed Solutions 1 elemento
  3. Modular HMIs 2 elementi
  4. Single Board Computer 2 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≥ 100 x 100mm 1 elemento
Memory
  1. memory ≤1 2 elementi
  2. memory ≤2 2 elementi
  3. memory ≤4 5 elementi
  4. memory ≤8 2 elementi
  5. soldered down 3 elementi
Mounting Option
  1. VESA Mount 2 elementi
  2. Rear Mount 2 elementi
  3. Panel Mount 2 elementi
  4. Flush Mount 2 elementi
Mass Storage
  1. soldered down 1 elemento
  2. I2C EEPROM 1 elemento
  3. microSD card slot 2 elementi
  4. onboard eMMC 2 elementi
  5. onboard eMMC 7 elementi
  6. SD interface 1 elemento
  7. SD interface 5 elementi
  8. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
  9. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. 0°C ÷ +50°C 2 elementi
  3. 0°C ÷ +60°C 6 elementi
  4. 20°C ÷ +70°C 2 elementi
  5. -20°C ÷ +70°C 2 elementi
  6. -40°C ÷ +60°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
Ttl Uarts
  1. TTL Uarts ≥1 4 elementi
  2. TTL Uarts ≥2 2 elementi
USB
  1. USB 2.0 ≥ 1 4 elementi
  2. USB 2.0 ≥ 2 2 elementi
  3. USB 2.0 ≥ 3 2 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 3.0 ≥ 1 1 elemento
  6. USB 3.1 ≥ 1 3 elementi
  7. USB 3.2 ≥ 1 2 elementi
  8. USB CLIENT 2 elementi
Video Interfaces
  1. DP 2 elementi
  2. DUAL CHANNEL LVDS 2 elementi
  3. eDP 2 elementi
  4. HDMI 1 elemento
  5. MIPI-CSI camera conn 1 elemento
  6. MIPI-DSI 4 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 elementi
  2. ONBOARD WI-FI/BLE 3 elementi
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions