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Q796-DISS-2-PK [Discontinued]

Q796-DISS-2-PK [Discontinued]

Q7 HEAT SINK: Q7-796 Heat Sink (PASSIVE)

Q796-DISS-1-PK [Discontinued]

Q796-DISS-1-PK [Discontinued]

Q7 HEAT SPREADER: Q7-796 Heat Spreader (PASSIVE)

Trizeps VII SX [Discontinued]

Trizeps VII SX [Discontinued]

SODIMM-200 CPU Computer on Module (CoM) with NXP i.MX 6SoloX Application Processor

Titan 220 RK3399 [Discontinued]

Titan 220 RK3399 [Discontinued]

Computer embedded senza ventola IP20 basato sul processore Rockchip RK3399. (DORADO - SYS-C31-IGW)

Tanaro Vision 7 RM MX8M-Mini [Discontinued]

Tanaro Vision 7 RM MX8M-Mini [Discontinued]

7.0 inch Other HMI based on NXP i.MX8M Mini processor. (TANARO 7.0 OF PCT IPS)

Prodotti Discontinuati

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Opzioni
Cpu Maker
  1. AMD 4 elementi
  2. Intel 18 elementi
  3. NVIDIA 1 elemento
  4. NXP 28 elementi
  5. Rockchip 5 elementi
  6. Texas Instruments 1 elemento
Cpu Power Consumption
  1. range 10-25 W 10 elementi
  2. range < 10 W 20 elementi
  3. range < 5 W 1 elemento
  4. range > 25 W 2 elementi
Cpu Type
  1. AMD® G-Series™ 3 elementi
  2. AMD® R-Series 2 elementi
  3. AMD® Ryzen™ embedded 1 elemento
  4. Intel® Atom™ 14 elementi
  5. Intel® Celeron® 12 elementi
  6. Intel® Core™ 2 elementi
  7. Intel® Pentium® 5 elementi
  8. Intel® Xeon® 2 elementi
  9. NVIDIA Tegra® T30 1 elemento
  10. NXP i.MX 8M Mini 1 elemento
  11. NXP i.MX 8X 1 elemento
  12. NXP i.MX6 24 elementi
  13. Rockchip PX30 1 elemento
  14. Rockchip RK3399 3 elementi
  15. Texas Instruments® O 1 elemento
Ethernet
  1. ETHERNET≥1 53 elementi
  2. ETHERNET≥2 25 elementi
  3. Production 1 elemento
  4. Production 1 elemento
  5. Production 1 elemento
  6. Production 1 elemento
  7. Production 1 elemento
  8. Production 1 elemento
  9. Production 1 elemento
Form Factor
  1. COM Express® 5 elementi
  2. COM-HPC® 1 elemento
  3. ETX® 1 elemento
  4. Qseven 8 elementi
  5. Trizeps SODIMM SOM 1 elemento
  6. Boxed Solutions 3 elementi
  7. Modular HMIs 23 elementi
  8. Single Board Computer 10 elementi
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 elementi
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 elemento
  3. 67,6 x 36,7 mm 1 elemento
  4. ≤ 100 x 100mm 14 elementi
  5. ≤ 80 x 80mm 8 elementi
  6. ≥ 100 x 100mm 33 elementi
Form Factor Specification
  1. 3,5" 2 elementi
  2. COM Express Basic 3 elementi
  3. COM Express Compact 2 elementi
  4. COM-HPC Client 1 elemento
  5. embedded NUC 1 elemento
  6. Other SBCs 5 elementi
  7. Pico-ITX 2 elementi
  8. Qseven 70x70 mm 7 elementi
  9. µQseven 70x40 1 elemento
  10. ≥ 100 x 100mm 1 elemento
InstallationDepth
  1. 30-35 6 elementi
  2. 35-40 7 elementi
  3. 40-45 5 elementi
  4. >45 8 elementi
  5. Qseven 70x70 mm 1 elemento
  6. Pico-ITX 1 elemento
  7. Qseven 70x70 mm 1 elemento
Memory
  1. memory ≤1 51 elementi
  2. memory ≤16 6 elementi
  3. memory ≤2 26 elementi
  4. memory ≤4 23 elementi
  5. memory ≤8 18 elementi
  6. memory ≥32 6 elementi
  7. soldered down 25 elementi
  8. SO_DIMM 11 elementi
Mounting Option
  1. VESA Mount 7 elementi
  2. Rear Mount 2 elementi
  3. Panel Mount 4 elementi
  4. Flush Mount 2 elementi
Mass Storage
  1. mSATA half-size slot 1 elemento
  2. onboard SSD 1 elemento
  3. PATA channel 2 elementi
  4. standard SATA connector 5 elementi
  5. CFAST slot 2 elementi
  6. M.2 NVMe SSD slot 4 elementi
  7. M.2 SATA SSD slot 4 elementi
  8. microSD card slot 16 elementi
  9. onboard eMMC 41 elementi
  10. onboard eMMC 4 elementi
  11. SATA channels ≥ 1 15 elementi
  12. SATA channels ≥ 1 5 elementi
  13. SATA channels ≥ 2 13 elementi
  14. SATA channels ≥ 3 2 elementi
  15. SATA channels ≥ 4 3 elementi
  16. SD interface 20 elementi
  17. SD interface 5 elementi
Operating Temperature
  1. -20°C ÷ +60°C 12 elementi
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 12 elementi
  4. 0°C ÷ +50°C 46 elementi
  5. 0°C ÷ +60°C 43 elementi
  6. 20°C ÷ +70°C 12 elementi
Pci Express
  1. PCI-e lanes ≥ 1 14 elementi
  2. PCI-e lanes ≥ 2 11 elementi
  3. PCI-e lanes ≥ 3 10 elementi
  4. PCI-e lanes ≥ 4 6 elementi
  5. PCI-e lanes ≥ 5 5 elementi
  6. -20°C ÷ +60°C 1 elemento
  7. -40°C ÷ +85°C 1 elemento
  8. 0°C ÷ +50°C 1 elemento
  9. 0°C ÷ +60°C 1 elemento
  10. 20°C ÷ +70°C 1 elemento
  11. 0°C ÷ +50°C 1 elemento
  12. 0°C ÷ +50°C 1 elemento
  13. 0°C ÷ +60°C 1 elemento
  14. 0°C ÷ +60°C 1 elemento
ScreenDimension
  1. 10-14 10 elementi
  2. 14-19 3 elementi
  3. 32 1 elemento
  4. 6 elementi
  5. >20 1 elemento
  6. RS232 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 16 elementi
  2. TTL Uarts ≥2 7 elementi
  3. TTL Uarts ≥3 2 elementi
USB
  1. USB 2.0 ≥ 1 50 elementi
  2. USB 2.0 ≥ 2 47 elementi
  3. USB 2.0 ≥ 3 30 elementi
  4. USB 2.0 ≥ 4 18 elementi
  5. USB 2.0 ≥ 5 11 elementi
  6. USB 2.0 ≥ 6 8 elementi
  7. USB 3.0 ≥ 1 18 elementi
  8. USB 3.0 ≥ 2 17 elementi
  9. USB 3.0 ≥ 3 4 elementi
  10. USB 3.0 ≥ 4 4 elementi
  11. USB 3.1 ≥ 1 2 elementi
  12. USB 3.1 ≥ 2 4 elementi
  13. USB 3.2 ≥ 1 1 elemento
  14. USB 4.0 ≥ 1 1 elemento
  15. USB 4.0 ≥ 2 1 elemento
  16. USB 4.0 ≥ 3 1 elemento
  17. USB 4.0 ≥ 4 1 elemento
  18. USB CLIENT 5 elementi
  19. USB OTG 25 elementi
Video Interfaces
  1. DDI 3 elementi
  2. DP 10 elementi
  3. DP++ 12 elementi
  4. DUAL CHANNEL LVDS 12 elementi
  5. eDP 13 elementi
  6. HDMI 31 elementi
  7. MIPI-CSI camera conn 2 elementi
  8. MIPI-DSI 1 elemento
  9. PARALLEL RGB 3 elementi
  10. SDVO 2 elementi
  11. SINGLE CHANNEL LVDS 23 elementi
  12. VGA 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 11 elementi
  2. M.2 SOCKET 2 KEY 1 elemento
  3. M.2 Socket 2 key B 4 elementi
  4. ONBOARD WI-FI/BLE 13 elementi
  5. DUAL CHANNEL LVDS 1 elemento
  6. SINGLE CHANNEL LVDS 1 elemento
  7. eDP 1 elemento
  8. HDMI 1 elemento
  9. SDVO 1 elemento
  10. SINGLE CHANNEL LVDS 1 elemento
  11. SINGLE CHANNEL LVDS 1 elemento