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Q796-DISS-2-PK [Discontinued]

Q796-DISS-2-PK [Discontinued]

Q7 HEAT SINK: Q7-796 Heat Sink (PASSIVE)

Q796-DISS-1-PK [Discontinued]

Q796-DISS-1-PK [Discontinued]

Q7 HEAT SPREADER: Q7-796 Heat Spreader (PASSIVE)

Trizeps VII SX [Discontinued]

Trizeps VII SX [Discontinued]

SODIMM-200 CPU Computer on Module (CoM) with NXP i.MX 6SoloX Application Processor

Titan 220 RK3399 [Discontinued]

Titan 220 RK3399 [Discontinued]

Computer embedded senza ventola IP20 basato sul processore Rockchip RK3399. (DORADO - SYS-C31-IGW)

Tanaro Vision 7 RM MX8M-Mini [Discontinued]

Tanaro Vision 7 RM MX8M-Mini [Discontinued]

7.0 inch Other HMI based on NXP i.MX8M Mini processor. (TANARO 7.0 OF PCT IPS)

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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. NXP 23 elementi
  3. Texas Instruments 1 elemento
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 5 elementi
  3. range < 5 W 1 elemento
Cpu Type
  1. AMD® G-Series™ 1 elemento
  2. AMD® R-Series 1 elemento
  3. NXP i.MX 8M Mini 1 elemento
  4. NXP i.MX6 20 elementi
  5. Texas Instruments® O 1 elemento
Ethernet
  1. ETHERNET≥1 23 elementi
  2. ETHERNET≥2 11 elementi
Form Factor
  1. COM Express® 1 elemento
  2. Qseven 1 elemento
  3. Trizeps SODIMM SOM 1 elemento
  4. Boxed Solutions 1 elemento
  5. Modular HMIs 17 elementi
  6. Single Board Computer 2 elementi
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 elemento
  2. ≤ 100 x 100mm 3 elementi
  3. ≤ 80 x 80mm 1 elemento
  4. ≥ 100 x 100mm 20 elementi
Form Factor Specification
  1. COM Express Compact 1 elemento
  2. Other SBCs 2 elementi
  3. Qseven 70x70 mm 1 elemento
InstallationDepth
  1. 30-35 5 elementi
  2. 35-40 7 elementi
  3. 40-45 4 elementi
  4. >45 1 elemento
  5. Qseven 70x70 mm 1 elemento
Memory
  1. memory ≤1 24 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 2 elementi
  4. memory ≤4 1 elemento
  5. memory ≤8 1 elemento
  6. memory ≥32 2 elementi
  7. soldered down 6 elementi
  8. SO_DIMM 1 elemento
Mounting Option
  1. Rear Mount 1 elemento
  2. Panel Mount 4 elementi
  3. Flush Mount 2 elementi
Mass Storage
  1. PATA channel 1 elemento
  2. CFAST slot 1 elemento
  3. microSD card slot 7 elementi
  4. onboard eMMC 24 elementi
  5. SATA channels ≥ 1 2 elementi
  6. SATA channels ≥ 2 1 elemento
  7. SD interface 15 elementi
Operating Temperature
  1. -20°C ÷ +60°C 4 elementi
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 5 elementi
  4. 0°C ÷ +50°C 22 elementi
  5. 0°C ÷ +60°C 22 elementi
  6. 20°C ÷ +70°C 5 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
  6. -20°C ÷ +60°C 1 elemento
  7. -40°C ÷ +85°C 1 elemento
  8. 0°C ÷ +50°C 1 elemento
  9. 0°C ÷ +60°C 1 elemento
  10. 20°C ÷ +70°C 1 elemento
ScreenDimension
  1. 10-14 6 elementi
  2. 14-19 1 elemento
  3. 32 1 elemento
  4. 4 elementi
Ttl Uarts
  1. TTL Uarts ≥1 4 elementi
  2. TTL Uarts ≥2 1 elemento
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 50 elementi
  2. USB 2.0 ≥ 2 47 elementi
  3. USB 2.0 ≥ 3 30 elementi
  4. USB 2.0 ≥ 4 18 elementi
  5. USB 2.0 ≥ 5 11 elementi
  6. USB 2.0 ≥ 6 8 elementi
  7. USB 3.0 ≥ 1 18 elementi
  8. USB 3.0 ≥ 2 17 elementi
  9. USB 3.0 ≥ 3 4 elementi
  10. USB 3.0 ≥ 4 4 elementi
  11. USB 3.1 ≥ 1 2 elementi
  12. USB 3.1 ≥ 2 4 elementi
  13. USB 3.2 ≥ 1 1 elemento
  14. USB 4.0 ≥ 1 1 elemento
  15. USB 4.0 ≥ 2 1 elemento
  16. USB 4.0 ≥ 3 1 elemento
  17. USB 4.0 ≥ 4 1 elemento
  18. USB CLIENT 5 elementi
  19. USB OTG 25 elementi
Video Interfaces
  1. DP++ 1 elemento
  2. DUAL CHANNEL LVDS 2 elementi
  3. eDP 1 elemento
  4. HDMI 10 elementi
  5. MIPI-CSI camera conn 1 elemento
  6. PARALLEL RGB 3 elementi
  7. SINGLE CHANNEL LVDS 6 elementi
  8. VGA 1 elemento
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 9 elementi
  2. DUAL CHANNEL LVDS 1 elemento
  3. SINGLE CHANNEL LVDS 1 elemento