Cross Platform Development Kit [Discontinued]

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The complete solutions to start developing with x86 and ARM Qseven modules

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The Cross Platform Development kit is a complete package that contains all that is necessary to start developing with Qseven® CPU modules, both on x86 and on ARM architectures, and verify the possibilities offered by these two different worlds. In every moment it will be possible to swap from one architecture to the other, with just minor SW adaptations, and see what are the possibilities offered by the other type of architecture with a minor effort and without time waste. Cross Platform Development Kit is the ideal way for x86 developers to approach ARM world, and vice-versa, exploring new possibilities and choosing the best solution for the application they have to build. The Cross Platform Carrier Board is used for SECOQSeven Design Guide: electrical schematics of the boards will be available for developers that began testing with this board, and want to recycle portions of it for their own-designed Carrier Boards, allowing thus a significant reduction of time for Hardware Development. SECO offers also the BSP, drivers and SDK for the single QuadMo boards used with the Development board. Using the same components in your own design, will allow sparing time also in Software Development. DEVELOPMENT KIT CONTENTS The Development kit contains the following material: • Cross Platform Carrier Board • LVDS Display (7” - 800x480 and/or 10” – 1024x768, at choice) • 4-wire T/S, already assembled on LCD display • LVDS to TTL 24-bit display converter • TTL to RS-232 Transceiver board • 19VDC Notebook Power Adapter, with Power Cords for connection to EUCEE 7/16, US NEMA 1-15, UK BS 1363A, JP JIS8303 • FFC cable for interconnection or Cross Platform Carrier Board and ARM QSeven® module camera connector • USB 2.0 Plug “A” – Plug “mini B” for USB client connection • Connection cables for adapter boards included in the kit • Connection cable for LVDS display • 4-Wire Touch Screen cable adapter Since the Cross Platform can be used with any SECO Qseven CPU Module, the Development Kit DOESN’T CONTAIN any QSeven® module, which has to be purchased separately.

Security & Compliance by Design

SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.

Secure Boot

Built-in Secure Boot to ensure system integrity from the first startup.

OTA Updates

Remote and secure software update distribution for your devices.

Device Monitoring

Continuous monitoring of device status and activity with Clea.

Secure Operating System

Yocto-based OS integration for customizable and secure system builds.

Certified Security

Compliance with EN18031-1 standards for secure and reliable embedded systems.

Docker Technology

Isolated and flexible application management through containerization.

Application Hub

Scopri le applicazioni compatibili con questo prodotto disponibili su SECO Application Hub: soluzioni pronte all’uso per accelerare lo sviluppo e l’implementazione di funzionalità intelligenti.

Machine Alert Assistance with Operator Recognition

Specifiche teniche

Descrizione	The Cross Platform Development kit is a complete package that contains all that is necessary to start developing with Qseven® CPU modules, both on x86 and on ARM architectures, and verify the possibilities offered by these two different worlds. In every moment it will be possible to swap from one architecture to the other, with just minor SW adaptations, and see what are the possibilities offered by the other type of architecture with a minor effort and without time waste. Cross Platform Development Kit is the ideal way for x86 developers to approach ARM world, and vice-versa, exploring new possibilities and choosing the best solution for the application they have to build. The Cross Platform Carrier Board is used for SECOQSeven Design Guide: electrical schematics of the boards will be available for developers that began testing with this board, and want to recycle portions of it for their own-designed Carrier Boards, allowing thus a significant reduction of time for Hardware Development. SECO offers also the BSP, drivers and SDK for the single QuadMo boards used with the Development board. Using the same components in your own design, will allow sparing time also in Software Development. DEVELOPMENT KIT CONTENTS The Development kit contains the following material: • Cross Platform Carrier Board • LVDS Display (7” - 800x480 and/or 10” – 1024x768, at choice) • 4-wire T/S, already assembled on LCD display • LVDS to TTL 24-bit display converter • TTL to RS-232 Transceiver board • 19VDC Notebook Power Adapter, with Power Cords for connection to EUCEE 7/16, US NEMA 1-15, UK BS 1363A, JP JIS8303 • FFC cable for interconnection or Cross Platform Carrier Board and ARM QSeven® module camera connector • USB 2.0 Plug “A” – Plug “mini B” for USB client connection • Connection cables for adapter boards included in the kit • Connection cable for LVDS display • 4-Wire Touch Screen cable adapter Since the Cross Platform can be used with any SECO Qseven CPU Module, the Development Kit DOESN’T CONTAIN any QSeven® module, which has to be purchased separately.
Video Interfaces Description	VGA DB-15HD + DVI-D Single Link connector LVDS LCD and Backlight connector, with voltage selection Video Camera Interface, NTSC/PAL/SECAM video decoder integrated
Mass Storage Description	2 x S-ATA connectors Hard Disk Power Connector 2 x SD/MMC slots SDI/O Internal Header
Networking Description	Gigabit Ethernet Interface
USB Description	6 x USB 2.0 standard “A” connector USB Client connector
PCI Description	1 x PCI Express x 1 Slot miniPCI express Slot
Audio Description	Triple Audio Jack 2 x S/P-DIF connectors (In & Out) AC’97 and HD Audio Codecs integrated, jumper selectable Direct Digital Audio Interface
Serial Ports	4 x Serial Ports (2 x DB-9 standard RS-232, 2 x TTL interface)
Other Interfaces	1 x CAN Interface 4 x GPI/O 3x 4 / 5 Wire T/S interfaces (I2C, SPI and USB controller directly onboard) Internal FPGA, with possibility of defining up to 64 User I/O’s JTAG connection LPC Bus interface SPI interface I2C applications included: EEPROM, Light Sensor, I/O Extender, SIM Card slot A/D Converter FAN: 3 pin Header, +5/+12V configurable with Tachometric signal
Power Supply	+5VDC/+12VDC for Desktop application, +19VDC for Notebook-like application Smart Battery Management Li-ION Single Cell Battery Management
Operating Temperature Description	Operating: 0° … +60°C Storage: -20° … +80°C
Dimensions	270 x 170 mm (10,63” x 6,69”)