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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computadora embebida sin ventilador con los procesadores Intel® Core™ de 11ª generación y los Intel® Celeron® SoCs (Codename: Tiger Lake UP3) más el chip de inteligencia artificial Axelera: alimentado por un solo Metis AIPU de hasta 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Ordenador integrado sin ventilador con los SoCs Intel® Core™ e Intel® Celeron® de 11.ª generación (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Ordenador integrado sin ventilador con los SoCs Intel® Atom® Serie X6000E, Intel® Pentium® y Celeron® Serie N y J (codename: Elkhart Lake). (PYXIS - SYS-D63-IPC)

Fanless Embedded PCs

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  2. range < 10 W 4 items
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  2. Boxed Solutions 13 items
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Memory
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  3. M.2 SATA SSD slot 7 items
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  5. onboard eMMC 5 items
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  7. SATA channels ≥ 1 4 items
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  4. 0°C ÷ +50°C 11 items
  5. 0°C ÷ +60°C 6 items
  6. 20°C ÷ +70°C 3 items
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Video Interfaces
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  2. DP++ 7 items
  3. HDMI 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 7 items
  2. M.2 SOCKET 2 KEY 5 items
  3. M.2 Socket 2 key B 5 items
  4. ONBOARD WI-FI/BLE 7 items