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Titan 300 TGL-UP3
Ordenador integrado sin ventilador con los SoCs Intel® Core™ e Intel® Celeron® de 11.ª generación (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
Cpu
11th Gen Intel® Core™ processors and Intel® Celeron® SoCs
Gráficas
Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
Conectividad
2x 2.5 GbE, Optional M.2 WWAN and WLAN modules
Memoria
Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
Datos del producto
Descripción
|
Ordenador integrado sin ventilador con los SoCs Intel® Core™ e Intel® Celeron® de 11.ª generación (codename: Tiger Lake UP3) |
|---|---|
Cpu
|
Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) |
|
Núcleos máx.
|
4 |
|
Memoria
|
2x DDR4-3200 SODIMM clots |
|
Gráfica
|
Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
Interfaces vídeos
|
2x Multimode DisplayPort 1.4, on dual DP++ connector |
Resolución vídeo
|
DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
Almacenamiento en masa
|
On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB |
Trabajo en red
|
2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request |
Usb
|
2x Superspeed USB 10Gbps ports on Dual Type-A sockets |
Audio
|
Lineout + MicIn combo TRRS Audio Jack |
Puertos de serie
|
2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
Otras interfaces
|
Optional 2x 12 poles terminal block connectors with the
Power ON Button |
Alimentación eléctrica
|
12VDC to 24VDC range, Mega-Fit 2p RA Connector |
Sistema operativo
|
Microsoft® Windows 10 IoT Enterprise LTSC |
Temperatura de funcionamiento
|
Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W)
*The values indicated refer to the maximum temperature of the environment of use of the device. It is the customer’s responsibility to verify that the temperature remains within the admissible range indicated in this manual and, if necessary, adopt any passive cooling solution together with an application-dependent cooling system that can ensure that the heat sink temperature will not damage the device itself and/or the connected mechanical parts. |
Dimensiones
|
199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives) |
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