GLIKSON [Discontinued]
Höhepunkte
GraphicsIntel® UHD Graphics 630/P630 Architektur, unterstützt bis zu 3 unabhängige Displays
Memorybis zu 128GB DDR4 Speicher auf 4x SO-DIMM Anschlüssen (ECC unterstützt)
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
VC82 Micro-Ups
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SBC mit Intel® Core™/Xeon® der 8. Generation (früher Coffee Lake H) und Core™/Xeon®/Pentium®/Celeron® der 9. Generation (früher Coffee Lake Refresh) |
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Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs: Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP) Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading
Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs: Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading Intel® Core™ i7-9850HE, Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP Intel® Celeron® G4932E, Dual Core @1.9GHz, 2MB Cache, 25W TDP |
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6 |
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2x DDR4-2666 oder 4x DDR4-2444 ECC SODIMM Steckplätze, bis zu 128GB insgesamt (nur mit 4 SODIMM Modulen). |
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Intel® UHD Graphics 630/P630 Architektur, bis zu 48 Ausführungseinheiten |
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2x DP++ Anschluss |
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DP++, eDP: bis zu 4096x2304 @ 60Hz, 24bpp |
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Bis zu 2x S-ATA M 7p Standardanschlüsse |
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Bis zu 2x Gigabit Ethernet Schnittstelle (Intel® I219-LM GbE PHY + optionaler Intel® I210/211 GbE Controller) |
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2x USB 3.1 Ports auf Standard Typ-A Buchsen, auf der Vorderseite des Boards platziert. |
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PCI-e x4-Schnittstelle am M.2-Sockel 3 Key M-Steckplatz für NVMe-Module |
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HD Audio codec on-board |
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2x Multistandard RS-232/RS-422/RS-485 serielle Schnittstellen auf interner Stiftleiste |
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LPC-Pin-Leiste |
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'2-poliger Mega-Fit-Stecker |
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Windows 10 64-bit |
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'0°C ÷ +60 °C (kommerzielle Version) *Gemessen an einem beliebigen Punkt des SECO-Standard-Heastpreaders für dieses Produkt, zu jeder Zeit (auch bei der Inbetriebnahme). Die tatsächliche Temperatur hängt stark von der Anwendung, dem Gehäuse und/oder der Umgebung ab. Der Kunde muss anwendungsspezifische Kühllösungen für das endgültige System in Betracht ziehen, um die Temperatur des Heatspreaders in dem angegebenen Bereich zu halten. |
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170 x 170 mm |
Teilenummer
SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs