Startseite
GLIKSON (formerly codenamed SBC-C66)

GLIKSON (formerly codenamed SBC-C66)

SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs

Available in Industrial Temperature Range

Data sheet

Kontaktieren Sie uns für mehr Informationen und Angebote

Kontakt

CPU

8th Gen Core™/Xeon® (Coffee Lake H) & 9th Gen Core™/ Xeon® /Pentium®/Celeron® CPUs (Coffee Lake Refresh)

Grafiken

Intel® UHD Graphics 630/P630 architecture, supports up to 3 independent displays

Konnektivität

2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 port (PCI-e x16 mechanical slot); VPU High Speed Connector with 4xUSB3.1 + 2x PCI-ex4

Speicher

up to 128GB DDR4 memory on 4x SO-DIMM Slots (ECC supported)

Produktbeschreibung

Technische Daten

Beschreibung	SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
CPU	Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs: Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP) Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs: Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading Intel® Core™ i7-9850HE, Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP Intel® Celeron® G4932E, Dual Core @1.9GHz, 2MB Cache, 25W TDP
Max. Kerne	6
Speicher	2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). ECC DDR4 memory modules supported only with Xeon® Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH
Grafiken	Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units Up to 3 independent displays supported DirectX 12, OpenGL 4.5, and OpenCL 2.1 support HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9 HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEGHEVC/H.265, VP9
Videoschnittstellen	2x DP++ connector eDP 40-poles connector (interface switched with LVDS) LVDS Single/Dual Channel connector (interface switched with eDP)
Videoauflösung	DP++, eDP: up to 4096x2304 @ 60Hz, 24bpp LVDS: up to 1920x1200 @ 60Hz
Massenspeicher	Up to 2x S-ATA M 7p standard connectors M.2 Socket 3 Key M 2280 Slot for NVME SSD modules with PCI-ex4 or SATA interface M.2 Socket 2 Key B Slot for SATA SSD modules (interface shared with PCI-e x2) microSD card slot
Networking	Up to 2x Gigabit Ethernet interface (Intel® I219-LM GbE PHY + optional Intel® I210/211 GbE controller) M.2 Socket1 Key E 2242 Slot for optional WLAN modules M.2 WWAN Slot (PCI-e x2 interface shared with SATA SSD module)
USB	2x USB 3.1 ports on standard Type-A sockets, placed on the front side of the board. 4x USB 3.1 (Superspeed + USB 2.0) ports on a PCIe/104 Connector for Expansion 1x USB 3.1 (Superspeed + USB 2.0) port on M.2 SSD/WWAN Key B Slot 2x USB 2.0 ports on standard Type-A sockets, placed on the front side of the board. 2x USB 2.0 ports on internal pin header 1x USB 2.0 port on M.2 Socket 1 Key E for WiFi modules
Pci	PCI-e x4 interface on M.2 Socket 3 Key M slot for NVMe modules PCI-e x2 port on M.2 SSD/WWAN Key B Slot PCI-e x1 port on M.2 Socket 1 Key E for WiFi modules 4x PCI-e x1 ports on PCIe/104 Connector for Expansion PCI-e x8 port on Network Card Adapter Slot 2x PCI-e x4 ports on PCI-e/104 Connector for Expansion
Audio	HD Audio codec on-board Mic In, Line out audio jacks Front Panel Audio Header
Serielle Schnittstellen	2x multistandard RS-232/RS-422/RS-485 serial ports on internal pin header
Andere Schnittstellen	LPC pin Header Front Panel Header 3-pin or 4-pin tachometric FAN Connector Optional TPM 2.0 device on-board
Stromversorgung	2-pin Mega-Fit connector VIN Range: +12V+24V
Betriebssystem	Windows 10 64-bit Linux OS 64-bit
Betriebstemperatur	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85 °C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Größe	170 x 170 mm

Dokumentation

Data Sheet	[Datasheet] HEBE Rel 1.3
Image	[Picture] HEBE_front [Picture] HEBE_back

Accessories

Sie haben nicht die Lösung gefunden, nach der Sie gesucht haben?

Das Standardprodukt erfüllt nicht Ihre Anforderungen? SECO bietet Ihnen die Möglichkeit, gemeinsam mit Ihnen eine teilweise oder komplett kundenspezifisch angepasste Hardware- und Softwarelösung zu entwickeln.

Mehr erfahren