GLIKSON

SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs

Available in Industrial Temperature Range

Datenblatt

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Kontakt

CPU

8th Gen Core™/Xeon® (Coffee Lake H) & 9th Gen Core™/ Xeon® /Pentium®/Celeron® CPUs (Coffee Lake Refresh)

Grafiken

Intel® UHD Graphics 630/P630 architecture, supports up to 3 independent displays

Konnektivität

2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 port (PCI-e x16 mechanical slot); VPU High Speed Connector with 4xUSB3.1 + 2x PCI-ex4

Speicher

up to 128GB DDR4 memory on 4x SO-DIMM Slots (ECC supported)

Produktbeschreibung

Technische Daten

Beschreibung	SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
CPU	Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs: Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP) Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs: Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading Intel® Core™ i7-9850HE, Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP Intel® Celeron® G4932E, Dual Core @1.9GHz, 2MB Cache, 25W TDP
Max. Kerne	6
Speicher	2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). ECC DDR4 memory modules supported only with Xeon® Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH
Grafiken	Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units Up to 3 independent displays supported DirectX 12, OpenGL 4.5, and OpenCL 2.1 support HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9 HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEGHEVC/H.265, VP9
Videoschnittstellen	2x DP++ connector eDP 40-poles connector (interface switched with LVDS) LVDS Single/Dual Channel connector (interface switched with eDP)
Videoauflösung	DP++, eDP: up to 4096x2304 @ 60Hz, 24bpp LVDS: up to 1920x1200 @ 60Hz
Massenspeicher	Up to 2x S-ATA M 7p standard connectors M.2 Socket 3 Key M 2280 Slot for NVME SSD modules with PCI-ex4 or SATA interface M.2 Socket 2 Key B Slot for SATA SSD modules (interface shared with PCI-e x2) microSD card slot
Networking	Up to 2x Gigabit Ethernet interface (Intel® I219-LM GbE PHY + optional Intel® I210/211 GbE controller) M.2 Socket1 Key E 2242 Slot for optional WLAN modules M.2 WWAN Slot (PCI-e x2 interface shared with SATA SSD module)
USB	2x USB 3.1 ports on standard Type-A sockets, placed on the front side of the board. 4x USB 3.1 (Superspeed + USB 2.0) ports on a PCIe/104 Connector for Expansion 1x USB 3.1 (Superspeed + USB 2.0) port on M.2 SSD/WWAN Key B Slot 2x USB 2.0 ports on standard Type-A sockets, placed on the front side of the board. 2x USB 2.0 ports on internal pin header 1x USB 2.0 port on M.2 Socket 1 Key E for WiFi modules
Pci	PCI-e x4 interface on M.2 Socket 3 Key M slot for NVMe modules PCI-e x2 port on M.2 SSD/WWAN Key B Slot PCI-e x1 port on M.2 Socket 1 Key E for WiFi modules 4x PCI-e x1 ports on PCIe/104 Connector for Expansion PCI-e x8 port on Network Card Adapter Slot 2x PCI-e x4 ports on PCI-e/104 Connector for Expansion
Audio	HD Audio codec on-board Mic In, Line out audio jacks Front Panel Audio Header
Serielle Schnittstellen	2x multistandard RS-232/RS-422/RS-485 serial ports on internal pin header
Andere Schnittstellen	LPC pin Header Front Panel Header 3-pin or 4-pin tachometric FAN Connector Optional TPM 2.0 device on-board
Stromversorgung	2-pin Mega-Fit connector VIN Range: +12V+24V
Betriebssystem	Windows 10 64-bit Linux OS 64-bit
Betriebstemperatur	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85 °C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Größe	170 x 170 mm

Dokumentation

Data Sheet	[Datasheet] HEBE Rel 1.3
Image	[Picture] HEBE_front [Picture] HEBE_back

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