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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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  1. NXP i.MX 93 1 item
  2. NXP i.MX 95 1 item
  3. NXP i.MX6 1 item
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  1. Modular HMIs 2 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
InstallationDepth
  1. 30-35 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 2 items
  3. soldered down 2 items
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  2. Rear Mount 3 items
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  1. onboard eMMC 1 item
  2. onboard eMMC 2 items
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  4. SD interface 2 items
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  2. 0°C ÷ +60°C 3 items
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USB
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  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 2 1 item
  4. USB OTG 1 item
Wireless Connectivity
  1. /M/o/Modular_7_ombra_Tavola_disegno_1_1_1.jpg 1 item