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USA 我们的产品
面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。
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SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80) -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC) -
SBC-3.5-MX83.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43) -
SBC-3.5-MX8X3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57) -
SBC-3.5-MX8M-Mini3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61) -
Carrier-Trizeps-pConXSCarrier Board for Trizeps SODIMM SOMs -
SOM-SMARC-MX8MSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8M Applications Processors. (LEXELL - C12) -
SOM-SMARC-Genio700SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors. (WILK) -
SOM-SMARC-MX8XSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors. (SWAN - D16) -
SOM-uQ7-MX8M-Mini-NanoμQseven® Computer on Module (CoM) with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors. (ELECTRA - C72)
