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SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 模块 COM-HPC® Intel 处理器 人工智能优化硬件 -
SBC-3.5-RV10003.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)SBC 3.5-inch SBC -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged(简体): 开发套件与配件 (简体): 配件 Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules(简体): 开发套件与配件 (简体): 开发套件与入门套件 COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit -
Carrier-COM-HPC-C78CCHPC-C78-C Carrier board(简体): 开发套件与配件 (简体): 载板 COM-HPC Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards COM-HPC Carrier Boards -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09)x86 COM Express® Intel 处理器