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  1. Pci Express
    PCI-e lanes ≥ 5
  2. Video Interfaces
    eDP
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Cpu Maker
  1. AMD 6 items
  2. Intel 15 items
  3. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 8 items
  2. range < 10 W 1 item
  3. range > 25 W 8 items
Cpu Type
  1. AMD Ryzen™ Embedded 3 items
  2. AMD® Ryzen™ embedded 4 items
  3. Intel® Atom™ 3 items
  4. Intel® Celeron® 3 items
  5. Intel® Core™ 13 items
  6. Intel® Pentium® 2 items
  7. Intel® Xeon® 2 items
  8. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 18 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 17 items
  2. COM-HPC® 5 items
  3. Single Board Computer 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 10 items
  3. ≥ 100 x 100mm 3 items
  4. COM Express® 3 items
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 6 items
  3. COM Express Compact 11 items
  4. COM-HPC Client 5 items
Memory
  1. memory ≤1 11 items
  2. memory ≤16 12 items
  3. memory ≤2 12 items
  4. memory ≤4 12 items
  5. memory ≤8 12 items
  6. memory ≥32 15 items
  7. soldered down 2 items
  8. SO_DIMM 17 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. standard SATA connector 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 5 items
  5. M.2 SATA SSD slot 4 items
  6. microSD card slot 2 items
  7. onboard eMMC 5 items
  8. SATA channels ≥ 1 12 items
  9. SATA channels ≥ 1 1 item
  10. SATA channels ≥ 2 1 item
  11. SATA channels ≥ 2 4 items
  12. SATA channels ≥ 2 14 items
  13. SATA channels ≥ 3 3 items
  14. SATA channels ≥ 4 1 item
  15. SD interface 1 item
  16. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 14 items
  4. 0°C ÷ +50°C 11 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 7 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 29 items
  2. PCI-e lanes ≥ 2 25 items
  3. PCI-e lanes ≥ 3 21 items
  4. PCI-e lanes ≥ 4 24 items
  5. PCI-e lanes ≥ 5 23 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
Ttl Uarts
  1. TTL Uarts ≥1 11 items
  2. TTL Uarts ≥2 14 items
USB
  1. USB 2.0 ≥ 1 13 items
  2. USB 2.0 ≥ 2 13 items
  3. USB 2.0 ≥ 3 13 items
  4. USB 2.0 ≥ 4 14 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 9 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 6 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 4 items
  15. USB 4.0 ≥ 2 3 items
  16. USB 4.0 ≥ 4 2 items
  17. USB CLIENT 1 item
  18. USB OTG 5 items
Video Interfaces
  1. DDI 18 items
  2. DP 13 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 16 items
  5. eDP 23 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 14 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Modular Vision
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solutions