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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged(简体): 开发套件与配件 (简体): 配件 Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules(简体): 开发套件与配件 (简体): 开发套件与入门套件 COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit -
Carrier-SMARC-2.0-B79Carrier board for SMARC rel. 2.0 / 2.1.1 compliant modules RB79(简体): 开发套件与配件 (简体): 载板 SMARC Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards SMARC Carrier Boards -
Carrier-COM-HPC-C78CCHPC-C78-C Carrier board(简体): 开发套件与配件 (简体): 载板 COM-HPC Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards COM-HPC Carrier Boards -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09)x86 COM Express® Intel 处理器 -
SOM-COM-HPC-A-TGL-HCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)x86 COM-HPC® Intel 处理器 人工智能优化硬件