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  1. Operating Temperature
    -40°C ÷ +85°C
  2. Video Interfaces
    eDP
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Cpu Maker
  1. AMD 4 items
  2. Arm System ready NXP 1 item
  3. Intel 19 items
  4. MediaTek 1 item
  5. NXP 4 items
  6. Qualcomm 1 item
  7. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 10 items
  2. range < 10 W 12 items
  3. range > 25 W 7 items
Cpu Type
  1. AMD Ryzen™ Embedded 3 items
  2. AMD® Ryzen™ embedded 2 items
  3. Intel® Atom™ 12 items
  4. Intel® Celeron® 10 items
  5. Intel® Core™ 8 items
  6. Intel® Pentium® 9 items
  7. Intel® Xeon® 2 items
  8. MediaTek Genio 510 1 item
  9. NXP i.MX 8M 1 item
  10. NXP i.MX 8M Mini 1 item
  11. NXP i.MX 8X 2 items
  12. NXP i.MX8 1 item
  13. Rockchip RK3588 1 item
  14. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 26 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 5 items
  3. Qseven 3 items
  4. SMARC 5 items
  5. Single Board Computer 7 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 16 items
  3. ≤ 80 x 80mm 6 items
  4. ≥ 100 x 100mm 7 items
  5. COM Express® 2 items
Form Factor Specification
  1. 3,5" 4 items
  2. COM Express Basic 3 items
  3. COM Express Compact 9 items
  4. COM-HPC Client 4 items
  5. embedded NUC 1 item
  6. Pico-ITX 2 items
  7. Qseven 70x70 mm 3 items
Memory
  1. memory ≤1 22 items
  2. memory ≤16 13 items
  3. memory ≤2 21 items
  4. memory ≤4 22 items
  5. memory ≤8 18 items
  6. memory ≥32 9 items
  7. soldered down 15 items
  8. SO_DIMM 13 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. standard SATA connector 3 items
  3. soldered down 1 item
  4. CFAST slot 1 item
  5. M.2 NVMe SSD slot 4 items
  6. M.2 SATA SSD slot 4 items
  7. microSD card slot 6 items
  8. onboard eMMC 18 items
  9. onboard eMMC 1 item
  10. SATA channels ≥ 1 15 items
  11. SATA channels ≥ 1 2 items
  12. SATA channels ≥ 2 4 items
  13. SATA channels ≥ 2 12 items
  14. SATA channels ≥ 3 1 item
  15. SD interface 4 items
  16. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 21 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 32 items
  4. 0°C ÷ +50°C 28 items
  5. 0°C ÷ +60°C 48 items
  6. 20°C ÷ +70°C 22 items
  7. -20°C ÷ +70°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 22 items
  2. PCI-e lanes ≥ 2 19 items
  3. PCI-e lanes ≥ 3 17 items
  4. PCI-e lanes ≥ 4 18 items
  5. PCI-e lanes ≥ 5 14 items
Ttl Uarts
  1. TTL Uarts ≥1 20 items
  2. TTL Uarts ≥2 24 items
  3. TTL Uarts ≥3 6 items
USB
  1. USB 2.0 ≥ 1 24 items
  2. USB 2.0 ≥ 2 24 items
  3. USB 2.0 ≥ 3 23 items
  4. USB 2.0 ≥ 4 22 items
  5. USB 2.0 ≥ 5 18 items
  6. USB 2.0 ≥ 6 17 items
  7. USB 3.0 ≥ 1 15 items
  8. USB 3.0 ≥ 2 13 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 7 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 3 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 3 items
  19. USB CLIENT 2 items
  20. USB OTG 6 items
Video Interfaces
  1. DDI 10 items
  2. DP 18 items
  3. DP++ 18 items
  4. DUAL CHANNEL LVDS 37 items
  5. eDP 32 items
  6. HDMI 38 items
  7. MIPI-CSI camera conn 9 items
  8. MIPI-DSI 13 items
  9. PARALLEL RGB 5 items
  10. SINGLE CHANNEL LVDS 36 items
  11. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 2 items
  4. ONBOARD WI-FI/BLE 7 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution