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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged(简体): 开发套件与配件 (简体): 配件 Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
Carrier-SMARC-E71Carrier board for SMARC 2.1.1 modules in a 3.5” form factor(简体): 开发套件与配件 (简体): 载板 SMARC Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards SMARC Carrier Boards -
Carrier-SMARC-2.0-B79Carrier board for SMARC rel. 2.0 / 2.1.1 compliant modules RB79(简体): 开发套件与配件 (简体): 载板 SMARC Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards SMARC Carrier Boards -
Carrier-Q7-D59Carrier Board for Qseven® Rel. 2.0 / 2.1 Compliant Modules in the 3.5” Form Factor. (Formerly CQ7-D59 )(简体): 开发套件与配件 (简体): 载板 Qseven Carrier Boards Dev Kits, Carrier Boards and Accessories Carrier Boards Qseven Carrier Boards -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® AMD 处理器 -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Intel 处理器