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SBC-3.5-RV10003.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)SBC 3.5-inch SBC -
SBC-3.5-MX8X3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)Arm NXP 处理器 SBC 3.5-inch SBC -
SBC-3.5-MX8M-Mini3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61)Arm NXP 处理器 SBC 3.5-inch SBC -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged(简体): 开发套件与配件 (简体): 配件 Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules(简体): 开发套件与配件 (简体): 开发套件与入门套件 COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® AMD 处理器