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  1. Mass Storage
    microSD card slot
  2. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. Intel 2 items
  4. NXP 4 items
  5. Rockchip 1 item
  6. Espressif 1 item
Cpu Power Consumption
  1. range 10-25 W 3 items
  2. range < 10 W 7 items
  3. range > 25 W 2 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Espressif ESP32-D0WD 1 item
  4. Intel® Atom™ 2 items
  5. Intel® Celeron® 2 items
  6. Intel® Pentium® 2 items
  7. NXP i.MX 8M 2 items
  8. NXP i.MX 8M Mini 1 item
  9. NXP i.MX6 1 item
  10. NXP i.MX8 1 item
  11. Rockchip RK3588 1 item
Ethernet
  1. ETHERNET≥1 9 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 2 items
  2. ESP32 1 item
  3. Qseven 2 items
  4. SMARC 2 items
  5. Single Board Computer 5 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 3 items
  3. ≤ 80 x 80mm 4 items
  4. ≥ 100 x 100mm 6 items
Form Factor Specification
  1. 3,5" 4 items
  2. COM Express Basic 1 item
  3. COM Express Compact 1 item
  4. ESP32 form factor 1 item
  5. Pico-ITX 1 item
  6. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 9 items
  2. memory ≤16 1 item
  3. memory ≤2 8 items
  4. memory ≤4 7 items
  5. memory ≤8 4 items
  6. memory ≥32 2 items
  7. soldered down 7 items
  8. SO_DIMM 2 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 3 items
  3. standard SATA connector 3 items
  4. soldered down 1 item
  5. CFAST slot 1 item
  6. I2C EEPROM 1 item
  7. M.2 NVMe SSD slot 5 items
  8. M.2 SATA SSD slot 8 items
  9. microSD card slot 12 items
  10. onboard eMMC 1 item
  11. onboard eMMC 32 items
  12. onboard eMMC 5 items
  13. SATA channels ≥ 1 23 items
  14. SATA channels ≥ 1 2 items
  15. SATA channels ≥ 2 5 items
  16. SATA channels ≥ 2 14 items
  17. SATA channels ≥ 3 1 item
  18. SD interface 12 items
  19. SD interface 3 items
  20. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  21. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -40°C ÷ +85°C 12 items
  3. 0°C ÷ +50°C 16 items
  4. 0°C ÷ +60°C 27 items
  5. 20°C ÷ +70°C 10 items
Pci Express
  1. PCI-e lanes ≥ 1 5 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 4 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 6 items
  2. TTL Uarts ≥2 6 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 6 items
  3. USB 2.0 ≥ 3 6 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 7 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.0 ≥ 3 2 items
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 1 item
  12. USB CLIENT 1 item
  13. USB OTG 6 items
Video Interfaces
  1. DDI 1 item
  2. DP 4 items
  3. DP++ 3 items
  4. DUAL CHANNEL LVDS 7 items
  5. eDP 6 items
  6. HDMI 8 items
  7. MIPI-CSI camera conn 3 items
  8. SINGLE CHANNEL LVDS 6 items
  9. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 1 item
  4. ONBOARD WI-FI/BLE 5 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution