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Cpu Maker
  1. Intel 3 items
  2. NXP 6 items
  3. Qualcomm 2 items
Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 3 items
  2. NXP i.MX 8M Mini 1 item
  3. NXP i.MX 8M Nano 1 item
  4. NXP i.MX6 5 items
  5. Qualcomm Dragonwing IQ-2390 1 item
  6. Qualcomm Dragonwing IQ-2390 1 item
Ethernet
  1. ETHERNET≥1 7 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 4 items
  3. Trizeps SODIMM SOM 1 item
  4. Boxed Solutions 3 items
  5. Modular HMIs 14 items
  6. Single Board Computer 11 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. Other SBCs 5 items
  2. Pico-ITX 2 items
Memory
  1. memory ≤1 4 items
  2. memory ≤16 2 items
  3. memory ≤2 4 items
  4. memory ≤4 3 items
  5. memory ≤8 1 item
  6. soldered down 3 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 2 items
  3. standard SATA connector 5 items
  4. M.2 NVMe SSD slot 2 items
  5. M.2 SATA SSD slot 8 items
  6. microSD card slot 12 items
  7. onboard eMMC 9 items
  8. onboard eMMC 11 items
  9. SATA channels ≥ 1 4 items
  10. SATA channels ≥ 1 2 items
  11. SATA channels ≥ 2 1 item
  12. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 10 items
  5. 20°C ÷ +70°C 1 item
Ttl Uarts
  1. TTL Uarts ≥1 3 items
USB
  1. USB 2.0 ≥ 1 8 items
  2. USB 2.0 ≥ 2 6 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 3.2 ≥ 1 2 items
  5. USB OTG 6 items
Video Interfaces
  1. DP++ 1 item
  2. DUAL CHANNEL LVDS 5 items
  3. eDP 2 items
  4. HDMI 7 items
  5. MIPI-DSI 2 items
  6. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 2 items
  4. ONBOARD WI-FI/BLE 4 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Evaluation Kit
  • Touch Display Solutions