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Cpu Maker
  1. AMD 2 items
  2. Arm System ready NXP 1 item
  3. Intel 13 items
  4. NXP 3 items
  5. Qualcomm 2 items
  6. Rockchip 2 items
Cpu Power Consumption
  1. range 10-25 W 6 items
  2. range < 10 W 8 items
  3. range > 25 W 2 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® G-Series™ 1 item
  3. AMD® R-Series 1 item
  4. AMD® Ryzen™ embedded 1 item
  5. Intel® Atom™ 8 items
  6. Intel® Celeron® 5 items
  7. Intel® Core™ 6 items
  8. Intel® Pentium® 4 items
  9. NXP i.MX 8M Mini 1 item
  10. NXP i.MX 8X 2 items
  11. NXP i.MX8 1 item
  12. Qualcomm® QCS5430 1 item
  13. Qualcomm® QCS6490 1 item
  14. Rockchip RK3399 1 item
  15. Rockchip RK3568 1 item
Ethernet
  1. ETHERNET≥1 40 items
  2. ETHERNET≥2 24 items
Form Factor
  1. COM-HPC® 5 items
  2. SMARC 8 items
  3. Boxed Solutions 1 item
  4. Single Board Computer 10 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 10 items
  3. ≤ 80 x 80mm 4 items
  4. ≥ 100 x 100mm 8 items
Form Factor Specification
  1. 3,5" 6 items
  2. COM-HPC Client 4 items
  3. embedded NUC 1 item
  4. Pico-ITX 3 items
  5. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 16 items
  2. memory ≤16 8 items
  3. memory ≤2 16 items
  4. memory ≤4 16 items
  5. memory ≤8 11 items
  6. memory ≥32 4 items
  7. soldered down 15 items
  8. SO_DIMM 6 items
Mass Storage
  1. onboard SSD 1 item
  2. standard SATA connector 5 items
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 4 items
  5. M.2 SATA SSD slot 6 items
  6. microSD card slot 6 items
  7. onboard eMMC 13 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 9 items
  10. SATA channels ≥ 1 2 items
  11. SATA channels ≥ 2 2 items
  12. SATA channels ≥ 2 3 items
  13. SD interface 2 items
  14. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -40°C ÷ +85°C 14 items
  3. 0°C ÷ +50°C 14 items
  4. 0°C ÷ +60°C 21 items
  5. 20°C ÷ +70°C 11 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 12 items
  2. PCI-e lanes ≥ 2 10 items
  3. PCI-e lanes ≥ 3 6 items
  4. PCI-e lanes ≥ 4 7 items
  5. PCI-e lanes ≥ 5 5 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 13 items
  2. TTL Uarts ≥2 15 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 15 items
  2. USB 2.0 ≥ 2 16 items
  3. USB 2.0 ≥ 3 16 items
  4. USB 2.0 ≥ 4 14 items
  5. USB 2.0 ≥ 5 6 items
  6. USB 2.0 ≥ 6 6 items
  7. USB 3.0 ≥ 1 8 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.0 ≥ 3 3 items
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 4 items
  12. USB 3.1 ≥ 2 2 items
  13. USB 3.2 ≥ 1 3 items
  14. USB 3.2 ≥ 2 5 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 1 item
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 3 items
  19. USB OTG 5 items
Video Interfaces
  1. DDI 3 items
  2. DP 16 items
  3. DP++ 23 items
  4. DUAL CHANNEL LVDS 21 items
  5. eDP 24 items
  6. HDMI 26 items
  7. MIPI-CSI camera conn 9 items
  8. MIPI-DSI 11 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 21 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 4 items
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 8 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution