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  1. Ethernet
    ETHERNET≥2
  2. Form Factor Dimensions
    ≥ 100 x 100mm
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Cpu Maker
  1. AMD 3 items
  2. Arm System ready NXP 1 item
  3. Intel 4 items
  4. NXP 2 items
  5. Qualcomm 1 item
  6. Rockchip 2 items
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 9 items
  3. range < 5 W 1 item
  4. range > 25 W 4 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series 1 item
  5. AMD® Ryzen™ embedded 1 item
  6. Intel® Atom™ 3 items
  7. Intel® Celeron® 2 items
  8. Intel® Pentium® 2 items
  9. NXP i.MX 8M Mini 1 item
  10. NXP i.MX 8X 1 item
  11. NXP i.MX8 1 item
  12. Qualcomm® QCS6490 1 item
  13. Rockchip RK3399 1 item
  14. Rockchip RK3568 1 item
Ethernet
  1. ETHERNET≥1 26 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 2 items
  3. Boxed Solutions 4 items
  4. Single Board Computer 7 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 67,6 x 36,7 mm 2 items
  3. ≤ 100 x 100mm 15 items
  4. ≤ 80 x 80mm 8 items
  5. ≥ 100 x 100mm 14 items
  6. COM Express® 1 item
Form Factor Specification
  1. 3,5" 6 items
  2. COM Express Basic 1 item
  3. embedded NUC 1 item
  4. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 12 items
  2. memory ≤16 2 items
  3. memory ≤2 12 items
  4. memory ≤4 12 items
  5. memory ≤8 8 items
  6. memory ≥32 2 items
  7. soldered down 10 items
  8. SO_DIMM 3 items
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 2 items
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 1 item
  5. M.2 SATA SSD slot 4 items
  6. microSD card slot 7 items
  7. onboard eMMC 9 items
  8. onboard eMMC 1 item
  9. SATA channels ≥ 1 6 items
  10. SATA channels ≥ 2 2 items
  11. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -40°C ÷ +85°C 7 items
  3. 0°C ÷ +50°C 12 items
  4. 0°C ÷ +60°C 12 items
  5. 20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 5 items
  2. PCI-e lanes ≥ 2 4 items
  3. PCI-e lanes ≥ 3 3 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 2 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 6 items
  2. TTL Uarts ≥2 5 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 3.0 ≥ 1 8 items
  7. USB 3.0 ≥ 2 7 items
  8. USB 3.0 ≥ 3 3 items
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 2 items
  11. USB 3.1 ≥ 2 1 item
  12. USB OTG 4 items
Video Interfaces
  1. DP 7 items
  2. DP++ 6 items
  3. DUAL CHANNEL LVDS 6 items
  4. eDP 8 items
  5. HDMI 6 items
  6. MIPI-CSI camera conn 2 items
  7. SINGLE CHANNEL LVDS 7 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. M.2 SOCKET 2 KEY 5 items
  3. M.2 Socket 2 key B 5 items
  4. ONBOARD WI-FI/BLE 5 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Modular Vision
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solutions