Menu
Account
我们的产品
模块
SBC
HMI 解决方案
无风扇嵌入式计算机
嵌入式计算机
支付系统
(简体): 开发套件与配件
人工智能优化硬件
Evaluation Kit
Touch Display Solutions

我们的产品

Shop By
Clear All

Items 1-6 of 10

Set Descending Direction
Page
per page
Shop By
现在购物由
  1. Cpu Maker
    Qualcomm
  2. Operating Temperature
    0°C ÷ +60°C
Clear All
Shopping Options
Cpu Maker
  1. AMD 12 items
  2. Arm System ready NXP 1 item
  3. Intel 41 items
  4. MediaTek 6 items
  5. NVIDIA 1 item
  6. NXP 30 items
  7. Qualcomm 10 items
  8. Rockchip 3 items
  9. Espressif 1 item
  10. Raspberry Pi 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 1 item
  4. range > 25 W 1 item
Cpu Type
  1. Qualcomm® QCS5430 1 item
  2. Qualcomm® QCS6490 4 items
  3. Qualcomm Dragonwing IQ-2390 1 item
  4. Qualcomm Dragonwing IQ-X 1 item
  5. Qualcomm Dragonwing 1 item
  6. Qualcomm® Dragonwing IQ-8 1 item
  7. Qualcomm Dragonwing IQ-2390 1 item
Ethernet
  1. ETHERNET≥1 7 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 2 items
  2. SMARC 4 items
  3. Modular HMIs 2 items
  4. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≥ 100 x 100mm 2 items
  3. COM Express® 2 items
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 4 items
  4. memory ≤8 2 items
  5. soldered down 6 items
  6. memory ≤32 1 item
  7. UFS 3.1 module on-board 1 item
  8. I2C EEPROM 2 items
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mounting Option
  1. VESA Mount 2 items
  2. Rear Mount 2 items
  3. Panel Mount 2 items
  4. Flush Mount 2 items
Mass Storage
  1. soldered down 1 item
  2. I2C EEPROM 1 item
  3. microSD card slot 2 items
  4. onboard eMMC 1 item
  5. onboard eMMC 6 items
  6. SD interface 1 item
  7. SD interface 5 items
  8. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  9. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 10 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
  7. -40°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
  4. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.2 ≥ 1 2 items
  12. USB CLIENT 1 item
Video Interfaces
  1. DP 5 items
  2. DUAL CHANNEL LVDS 4 items
  3. eDP 3 items
  4. MIPI-CSI camera conn 3 items
  5. MIPI-DSI 5 items
  6. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 3 items
  3. /s/n/snapdragon-x_per_sito.jpg 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Evaluation Kit
  • Touch Display Solutions