ZH
DE 
EN - € 
ES 
FR 
IT 
JP 
USA 
SOM-COMe-CT6-MBPF [Discontinued]
COM Express® Compact Type 6 Computer on Module (CoM) with AMD Embedded 3rd generation R-Series SoC (Codename: Merlin Falcon), G-Series SoC-I (Codename: Brown Falcon) or G-Series SoC-J (Codename: Prairie Falcon)
(AMOS - A98)
Available in Industrial Temperature Range
中央处理器
AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J
图形
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
连接
4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
记忆
Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules
产品详情
说明
|
SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference. |
|---|---|
中央处理器说明
|
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W |
|
最大核数
|
4 |
|
内存说明
|
R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz |
|
图形说明
|
AMD Radeon 3rd -Generation Graphics Core Next (GCN) |
视频界面说明
|
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) |
视频分辨率说明
|
DDIs: up to 4K |
大容量存储器说明
|
2 x SATA Gen3 Channels |
网络说明
|
Gigabit Ethernet interface |
USB说明
|
4 x USB 3.0 Host ports |
|
Pci Description
|
3 x PCI-e x 1 lanes |
音频说明
|
HD Audio Interface |
串行端口
|
2 x HS UARTs |
其他接口
|
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management |
电源
|
+12VDC ± 10% and + 5VSB (optional) |
操作系统
|
Microsoft® Windows 7 |
操作温度说明
|
0°C ÷ +60 °C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
尺寸
|
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
Accessories
