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  1. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
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  2. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  3. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
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  4. SOM-SMARC-MX95
    SOM-SMARC-MX95
    SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors
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  5. SOM-SMARC-QCS5430
    SOM-SMARC-QCS5430
    SMARC® 2.1.1 module with Qualcomm® QCS5430 processor
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  6. SOM-SMARC-QCS6490
    SOM-SMARC-QCS6490
    SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor
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  7. SBC-pITX-BT
    SBC-pITX-BT
    Pico-ITX SBC with Intel® Atom™ E3800 (codename: Bay Trail) Processors. (LAMPOS - A44)
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  8. SBC-eNUC-APL
    SBC-eNUC-APL
    embedded NUC™ SBC with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ALVIN - B68)
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  9. SBC-3.5-MX8M
    SBC-3.5-MX8M
    3.5” SBC with the NXP i.MX 8M Applications Processors. (ALBION - C20)
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  10. SBC-3.5-RK3399
    SBC-3.5-RK3399
    3.5” SBC with Rockchip RK3399 SoC. (SOLON - C31)
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  1. Operating Temperature -20°C ÷ +60°C Remove This Item
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Cpu Power Consumption
  1. range 10-25 W 12 item
  2. range < 10 W 22 item
  3. range > 25 W 4 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 1 item
  3. AMD® Ryzen™ embedded V-Series™ 1 item
  4. Intel® Atom™ 11 item
  5. Intel® Celeron® 9 item
  6. Intel® Core™  4 item
  7. Intel® Pentium®  6 item
  8. NXP i.MX 8M 3 item
  9. NXP i.MX 8M Mini 2 item
  10. NXP i.MX 8M Nano 1 item
  11. NXP i.MX 8X 2 item
  12. NXP i.MX 95 1 item
  13. NXP i.MX6  3 item
  14. NXP i.MX8  2 item
  15. Qualcomm® QCS5430 1 item
  16. Qualcomm® QCS6490 1 item
  17. Rockchip RK3399 1 item
  18. Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 33 item
  2. ETHERNET≥2 16 item
Form Factor
  1. Boxed Solutions 2 item
  2. COM Express® 8 item
  3. Qseven 8 item
  4. Single Board Computer  8 item
  5. SMARC 8 item
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 3 item
  2. ≤ 100 x 100mm 24 item
  3. ≤ 80 x 80mm 13 item
  4. ≥ 100 x 100mm 8 item
Form Factor Specification
  1. 3,5" 5 item
  2. COM Express Basic 1 item
  3. COM Express Compact 7 item
  4. embedded NUC 1 item
  5. Pico-ITX 2 item
  6. Qseven 70x70 mm 5 item
  7. µQseven 70x40 3 item
Mass Storage
  1. M.2 SATA SSD slot 4 item
  2. microSD card slot  9 item
  3. mSATA half-size slot 1 item
  4. onboard eMMC 26 item
  5. onboard SSD 4 item
  6. SATA channels ≥ 1 20 item
  7. SATA channels ≥ 2  13 item
  8. SATA channels ≥ 3 2 item
  9. SATA channels ≥ 4 2 item
  10. SD interface  15 item
  11. standard SATA connector 2 item
Memory
  1. soldered down 22 item
  2. SO_DIMM 10 item
  3. ≤1 34 item
  4. ≤16 11 item
  5. ≤2 32 item
  6. ≤4 31 item
  7. ≤8 22 item
  8. ≥32 7 item
Pci Express
  1. PCI-e lanes ≥ 1 28 item
  2. PCI-e lanes ≥ 2 21 item
  3. PCI-e lanes ≥ 3 14 item
  4. PCI-e lanes ≥ 4 11 item
  5. PCI-e lanes ≥ 5 6 item
Ttl Uarts
  1. ≥1 29 item
  2. ≥2 24 item
  3. ≥3 9 item
USB
  1. USB 2.0 ≥ 1  31 item
  2. USB 2.0 ≥ 2  28 item
  3. USB 2.0 ≥ 3 27 item
  4. USB 2.0 ≥ 4 23 item
  5. USB 2.0 ≥ 5 16 item
  6. USB 2.0 ≥ 6 12 item
  7. USB 3.0 ≥ 1 20 item
  8. USB 3.0 ≥ 2 13 item
  9. USB 3.0 ≥ 3 6 item
  10. USB 3.0 ≥ 4 4 item
  11. USB 3.1 ≥ 1 5 item
  12. USB 3.1 ≥ 2 3 item
  13. USB 3.2 ≥ 1 3 item
  14. USB 3.2 ≥ 2 3 item
  15. USB OTG 11 item
Video Interfaces
  1. DDI 6 item
  2. DP 16 item
  3. DP++ 5 item
  4. DUAL CHANNEL LVDS 26 item
  5. eDP 20 item
  6. HDMI 21 item
  7. MIPI-CSI camera connector 6 item
  8. MIPI-DSI 5 item
  9. SINGLE CHANNEL LVDS 25 item
  10. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 7 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 2 item
  3. M.2 Socket 2 key B (SSD) 2 item
  4. ONBOARD WI-FI/BLE 9 item