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  1. Titan 240 APL
    Titan 240 APL
    Fanless Embedded Computer with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (PEGASUS - SYS-C41-IPC) SYS-C41-IPC
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  2. Titan 235 APL
    Titan 235 APL
    Fanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC)
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  3. Titan 230 APL
    Titan 230 APL
    Fanless Embedded Computer with Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (HYDRUS - SYS-B68-IGW)
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  4. Titan 300 TGL-UP3 AI
    Titan 300 TGL-UP3 AI
    Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 
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  5. Titan 250 APL IP65
    Titan 250 APL IP65
    IP65 Fanless Embedded PC based on Intel® Atom® x5 (codename: Apollo Lake) Applications Processor. (CHAMALEON - SYS-B68-HEN)
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  6. SBC-SANTOKA-MX6
    SBC-SANTOKA-MX6
    Single Board Computer (SBC) based on NXP i.MX6 processor
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  7. SBC-eNUC-APL
    SBC-eNUC-APL
    embedded NUC™ SBC with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ALVIN - B68)
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  8. SBC-3.5-RK3399
    SBC-3.5-RK3399
    3.5” SBC with Rockchip RK3399 SoC. (SOLON - C31)
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  9. SBC-pITX-APL
    SBC-pITX-APL
    Pico-ITX SBC with Intel® Atom® X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ADLER - C41)
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  10. SBC-3.5-MX8
    SBC-3.5-MX8
    3.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)
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Cpu Power Consumption
  1. range 10-25 W 10 item
  2. range < 10 W 13 item
  3. range < 5 W 1 item
  4. range > 25 W 2 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD® G-Series™ 1 item
  3. AMD® R-Series  1 item
  4. Intel® Atom™ 16 item
  5. Intel® Celeron® 14 item
  6. Intel® Core™  7 item
  7. Intel® Pentium®  10 item
  8. NXP i.MX 8M Mini 1 item
  9. NXP i.MX 8M Plus 2 item
  10. NXP i.MX 8X 2 item
  11. NXP i.MX 933/935 1 item
  12. NXP i.MX 95 1 item
  13. NXP i.MX6  3 item
  14. NXP i.MX8  1 item
  15. Qualcomm® QCS5430 1 item
  16. Qualcomm® QCS6490 1 item
  17. Rockchip RK3399 4 item
  18. Rockchip RK3568 1 item
  19. Zynq® Ultrascale+™  1 item
Form Factor
  1. Boxed Solutions 8 item
  2. COM Express® 1 item
  3. COM-HPC® 3 item
  4. Modular HMIs 6 item
  5. Single Board Computer  10 item
  6. SMARC 11 item
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
  2. ≤ 100 x 100mm 12 item
  3. ≤ 80 x 80mm 6 item
  4. ≥ 100 x 100mm 17 item
Form Factor Specification
  1. 3,5" 5 item
  2. COM Express Basic 1 item
  3. COM-HPC Client 2 item
  4. embedded NUC 1 item
  5. Pico-ITX 2 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 4 item
  3. M.2 SATA SSD slot 10 item
  4. microSD card slot  7 item
  5. onboard eMMC 33 item
  6. onboard SSD 3 item
  7. SATA channels ≥ 1 14 item
  8. SATA channels ≥ 2  6 item
  9. SATA channels ≥ 3 2 item
  10. SATA channels ≥ 4 2 item
  11. SD interface  11 item
  12. standard SATA connector 3 item
Memory
  1. soldered down 30 item
  2. SO_DIMM 8 item
  3. ≤1 37 item
  4. ≤16 10 item
  5. ≤2 36 item
  6. ≤4 34 item
  7. ≤8 27 item
  8. ≥32 6 item
Operating Temperature
  1. -20°C ÷ +60°C 16 item
  2. -20°C ÷ +70°C 5 item
  3. -40°C ÷ +85°C 18 item
  4. 0°C ÷ +50°C 34 item
  5. 0°C ÷ +60°C 30 item
  6. 20°C ÷ +70°C 16 item
Pci Express
  1. PCI-e lanes ≥ 1 16 item
  2. PCI-e lanes ≥ 2 13 item
  3. PCI-e lanes ≥ 3 7 item
  4. PCI-e lanes ≥ 4 7 item
  5. PCI-e lanes ≥ 5 3 item
Ttl Uarts
  1. ≥1 17 item
  2. ≥2 19 item
  3. ≥3 9 item
USB
  1. USB 2.0 ≥ 1  30 item
  2. USB 2.0 ≥ 2  31 item
  3. USB 2.0 ≥ 3 18 item
  4. USB 2.0 ≥ 4 15 item
  5. USB 2.0 ≥ 5 7 item
  6. USB 2.0 ≥ 6 6 item
  7. USB 3.0 ≥ 1 22 item
  8. USB 3.0 ≥ 2 18 item
  9. USB 3.0 ≥ 3 2 item
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 5 item
  12. USB 3.1 ≥ 2 3 item
  13. USB 3.2 ≥ 1 6 item
  14. USB 3.2 ≥ 2 8 item
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 1 item
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 item
  19. USB OTG 10 item
Video Interfaces
  1. DDI 2 item
  2. DP 14 item
  3. DP++ 20 item
  4. DUAL CHANNEL LVDS 16 item
  5. eDP 18 item
  6. HDMI 25 item
  7. MIPI-CSI camera connector 5 item
  8. MIPI-DSI 7 item
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 14 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 18 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 6 item
  3. M.2 Socket 2 key B (SSD) 8 item
  4. ONBOARD WI-FI/BLE 11 item
Installation Depth
  1. 35-40 2 item
  2. >45 7 item
Screen Dimension
  1. <8 1 item
  2. 10-14 5 item
  3. 14-19 2 item
  4. >20 1 item