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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module with Qualcomm® QCS5430 processor

Qualcomm Processor

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Cpu Type
  1. NXP i.MX 93 1 item
  2. Qualcomm® QCS6490 2 items
Ethernet
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  2. ETHERNET≥2 1 item
Form Factor
  1. Boxed Solutions 1 item
  2. Modular HMIs 2 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Memory
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  2. soldered down 1 item
Mounting Option
  1. VESA Mount 2 items
  2. Rear Mount 2 items
  3. Panel Mount 2 items
  4. Flush Mount 2 items
Mass Storage
  1. I2C EEPROM 1 item
  2. onboard eMMC 4 items
  3. onboard eMMC 3 items
  4. SD interface 3 items
  5. SD interface 3 items
  6. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
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  2. 0°C ÷ +60°C 2 items
USB
  1. USB 3.0 ≥ 1 1 item
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  3. USB CLIENT 2 items
Video Interfaces
  1. HDMI 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item