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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Intel Processor

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  1. USB
    USB 3.2 ≥ 2
  2. Wireless Connectivity
    M.2 SOCKET 2 KEY
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Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 3 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 2 items
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 3 items
Form Factor
  1. Boxed Solutions 2 items
  2. Single Board Computer 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
Form Factor Specification
  1. Pico-ITX 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤16 3 items
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. memory ≥32 1 item
  7. soldered down 2 items
  8. SO_DIMM 1 item
Mass Storage
  1. standard SATA connector 1 item
  2. M.2 SATA SSD slot 2 items
  3. onboard eMMC 2 items
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 1 item
Ttl Uarts
  1. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.0 ≥ 2 1 item
  5. USB 3.2 ≥ 1 1 item
  6. USB 3.2 ≥ 2 3 items
Video Interfaces
  1. DP++ 2 items
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. M.2 SOCKET 2 KEY 3 items
  3. ONBOARD WI-FI/BLE 1 item