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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Intel Processor

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  1. Mass Storage
    onboard eMMC
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    0°C ÷ +60°C
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Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. Modular HMIs 2 items
  2. Single Board Computer 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤16 2 items
  2. memory ≤2 1 item
  3. soldered down 1 item
Mounting Option
  1. VESA Mount 1 item
  2. Rear Mount 1 item
  3. Panel Mount 1 item
  4. Flush Mount 1 item
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 4 items
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 5 items
  5. M.2 SATA SSD slot 14 items
  6. microSD card slot 5 items
  7. onboard eMMC 2 items
  8. onboard eMMC 15 items
  9. onboard eMMC 3 items
  10. SATA channels ≥ 1 22 items
  11. SATA channels ≥ 2 1 item
  12. SATA channels ≥ 2 2 items
  13. SATA channels ≥ 2 16 items
  14. SATA channels ≥ 3 5 items
  15. SATA channels ≥ 4 4 items
  16. SD interface 4 items
  17. SD interface 2 items
Operating Temperature
  1. 0°C ÷ +50°C 2 items
  2. 0°C ÷ +60°C 3 items
ScreenDimension
  1. 14-19 1 item
USB
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  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 1 1 item
  4. USB CLIENT 2 items
Video Interfaces
  1. DP++ 1 item
Wireless Connectivity
  1. M.2 Socket 2 key B 1 item