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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Intel Processor

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  1. Mass Storage
    onboard SSD
  2. USB
    USB 3.0 ≥ 1
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Cpu Power Consumption
  1. range 10-25 W 3 items
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 3 items
  2. Intel® Celeron® 2 items
  3. Intel® Pentium® 2 items
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 3 items
Form Factor
  1. Boxed Solutions 1 item
  2. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. embedded NUC 1 item
  2. Pico-ITX 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 3 items
  4. memory ≤8 3 items
  5. soldered down 3 items
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 1 item
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 1 item
  5. M.2 SATA SSD slot 5 items
  6. microSD card slot 3 items
  7. onboard eMMC 8 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 12 items
  10. SATA channels ≥ 2 8 items
  11. SATA channels ≥ 3 2 items
  12. SATA channels ≥ 4 1 item
  13. SD interface 3 items
  14. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 3 items
  7. USB 3.0 ≥ 2 3 items
  8. USB 3.0 ≥ 3 1 item
Video Interfaces
  1. DP 2 items
  2. DP++ 3 items
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 1 item
  5. HDMI 2 items
  6. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. M.2 SOCKET 2 KEY 1 item
  3. M.2 Socket 2 key B 3 items