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Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPSx86 Intel Processor Безвентиляторные встраиваемые компьютеры Аппаратное обеспечение AI -
SOM-COMe-CT6-EHLCOM Express® 3.1 Type 6 Compact Computer on Module (CoM) with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (Codename: Elkhart Lake). (EUPHORIA - E37)x86 COM Express® Intel Processor -
SOM-COMe-BT6-RPL-PCOM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)x86 COM Express® Intel Processor -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)x86 Модули COM-HPC® Intel Processor -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Модули COM-HPC® Intel Processor Аппаратное обеспечение AI -
Palladio 500 RPLModular embedded PC with 13th Gen Intel® Core™ processorsx86 Intel Processor Встроенные компьютеры Аппаратное обеспечение AI




