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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. Video Interfaces
    MIPI-DSI
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Cpu Maker
  1. Intel 2 items
  2. NXP 7 items
  3. Qualcomm 4 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
  3. range < 5 W 5 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 1 item
  5. NXP i.MX 8M 2 items
  6. NXP i.MX 8M Mini 2 items
  7. NXP i.MX 8M Nano 1 item
  8. NXP i.MX 8M Plus 1 item
  9. NXP i.MX 8X 1 item
  10. NXP i.MX 933/935 1 item
  11. Qualcomm Snapdragon 1 item
  12. Qualcomm® QCS5430 1 item
  13. Qualcomm® QCS6490 1 item
  14. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 10 items
  2. ETHERNET≥2 8 items
Form Factor
  1. COM-HPC® 1 item
  2. Myon MicroModule SOM 2 items
  3. SMARC 7 items
  4. Trizeps SODIMM SOM 3 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 2 items
  2. 67,6 x 36,7 mm 3 items
  3. ≤ 100 x 100mm 6 items
  4. ≤ 80 x 80mm 4 items
Memory
  1. memory ≤1 10 items
  2. memory ≤2 11 items
  3. memory ≤4 9 items
  4. memory ≤8 7 items
  5. soldered down 7 items
  6. SO_DIMM 1 item
  7. memory ≤32 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. onboard eMMC 11 items
  3. SATA channels ≥ 1 1 item
  4. SATA channels ≥ 2 1 item
  5. SD interface 6 items
  6. SD interface 1 item
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 5 items
  2. -40°C ÷ +85°C 10 items
  3. 0°C ÷ +50°C 5 items
  4. 0°C ÷ +60°C 8 items
  5. 20°C ÷ +70°C 5 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 7 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
  1. TTL Uarts ≥1 10 items
  2. TTL Uarts ≥2 10 items
  3. TTL Uarts ≥3 9 items
USB
  1. USB 2.0 ≥ 1 8 items
  2. USB 2.0 ≥ 2 8 items
  3. USB 2.0 ≥ 3 5 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 6 items
  9. USB 3.1 ≥ 1 2 items
  10. USB 3.2 ≥ 1 1 item
  11. USB 4.0 ≥ 1 1 item
  12. USB 4.0 ≥ 2 1 item
  13. USB 4.0 ≥ 3 1 item
  14. USB 4.0 ≥ 4 1 item
  15. USB OTG 4 items
Video Interfaces
  1. DDI 20 items
  2. DP 25 items
  3. DP++ 13 items
  4. DUAL CHANNEL LVDS 38 items
  5. eDP 39 items
  6. HDMI 38 items
  7. MIPI-CSI camera conn 12 items
  8. MIPI-DSI 13 items
  9. PARALLEL RGB 4 items
  10. SINGLE CHANNEL LVDS 34 items
  11. VGA 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 3 items
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®