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COM-HPC®
Qseven®
SMARC®
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  1. Operating Temperature
    -40°C ÷ +85°C
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Cpu Maker
  1. AMD 5 items
  2. Intel 16 items
  3. MediaTek 2 items
  4. NXP 15 items
  5. Qualcomm 3 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 10 items
  2. range < 10 W 12 items
  3. range < 5 W 5 items
  4. range > 25 W 6 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 9 items
  5. Intel® Celeron® 8 items
  6. Intel® Core™ 9 items
  7. Intel® Pentium® 7 items
  8. Intel® Xeon® 1 item
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 8M 3 items
  12. NXP i.MX 8M Mini 2 items
  13. NXP i.MX 8M Nano 1 item
  14. NXP i.MX 8M Plus 2 items
  15. NXP i.MX 8X 1 item
  16. NXP i.MX 933/935 1 item
  17. NXP i.MX 95 1 item
  18. NXP i.MX6 4 items
  19. NXP i.MX8 1 item
  20. Rockchip RK3588 1 item
  21. Zynq® Ultras 1 item
  22. Qualcomm Dragonwing IQ-X 1 item
  23. Qualcomm Dragonwing 1 item
  24. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 34 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 15 items
  2. COM-HPC® 3 items
  3. Myon MicroModule SOM 1 item
  4. Qseven 7 items
  5. SMARC 12 items
  6. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 4 items
  5. ≤ 100 x 100mm 23 items
  6. ≤ 80 x 80mm 12 items
  7. ≥ 100 x 100mm 3 items
  8. COM Express® 3 items
Form Factor Specification
  1. COM Express Basic 4 items
  2. COM Express Compact 10 items
  3. COM-HPC Client 2 items
  4. Qseven 70x70 mm 5 items
  5. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 32 items
  2. memory ≤16 13 items
  3. memory ≤2 31 items
  4. memory ≤4 29 items
  5. memory ≤8 23 items
  6. memory ≥32 10 items
  7. soldered down 19 items
  8. SO_DIMM 13 items
  9. memory ≤32 1 item
  10. UFS 3.1 module on-board 1 item
  11. I2C EEPROM 2 items
  12. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. I2C EEPROM 1 item
  5. M.2 NVMe SSD slot 3 items
  6. microSD card slot 4 items
  7. onboard eMMC 27 items
  8. onboard eMMC 2 items
  9. SATA channels ≥ 1 19 items
  10. SATA channels ≥ 2 3 items
  11. SATA channels ≥ 2 13 items
  12. SATA channels ≥ 3 1 item
  13. SD interface 12 items
  14. SD interface 2 items
  15. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  16. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 25 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 42 items
  4. 0°C ÷ +50°C 30 items
  5. 0°C ÷ +60°C 48 items
  6. 20°C ÷ +70°C 23 items
  7. -20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 28 items
  2. PCI-e lanes ≥ 2 21 items
  3. PCI-e lanes ≥ 3 17 items
  4. PCI-e lanes ≥ 4 20 items
  5. PCI-e lanes ≥ 5 13 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 31 items
  2. TTL Uarts ≥2 33 items
  3. TTL Uarts ≥3 14 items
USB
  1. USB 2.0 ≥ 1 31 items
  2. USB 2.0 ≥ 2 28 items
  3. USB 2.0 ≥ 3 24 items
  4. USB 2.0 ≥ 4 24 items
  5. USB 2.0 ≥ 5 19 items
  6. USB 2.0 ≥ 6 18 items
  7. USB 3.0 ≥ 1 17 items
  8. USB 3.0 ≥ 2 16 items
  9. USB 3.0 ≥ 3 7 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 6 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 3 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 2 items
  20. USB OTG 13 items
Video Interfaces
  1. DDI 10 items
  2. DP 16 items
  3. DP++ 9 items
  4. DUAL CHANNEL LVDS 27 items
  5. eDP 23 items
  6. HDMI 27 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 10 items
  9. PARALLEL RGB 4 items
  10. SINGLE CHANNEL LVDS 26 items
  11. VGA 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 7 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
  4. /s/n/snapdragon-x_per_sito.jpg 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®