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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. Memory
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Cpu Maker
  1. AMD 1 item
  2. Intel 11 items
  3. MediaTek 2 items
  4. NXP 9 items
  5. Qualcomm 3 items
Cpu Power Consumption
  1. range 10-25 W 8 items
  2. range < 10 W 15 items
Cpu Type
  1. Intel® Atom™ 9 items
  2. Intel® Celeron® 7 items
  3. Intel® Core™ 3 items
  4. Intel® Pentium® 5 items
  5. MediaTek Genio 510 1 item
  6. MediaTek Genio 700 1 item
  7. NXP i.MX 8M 2 items
  8. NXP i.MX 8M Mini 1 item
  9. NXP i.MX 8M Nano 1 item
  10. NXP i.MX 8M Plus 1 item
  11. NXP i.MX 8X 1 item
  12. NXP i.MX 933/935 1 item
  13. NXP i.MX6 2 items
  14. NXP i.MX8 1 item
  15. Qualcomm® QCS5430 1 item
  16. Qualcomm® QCS6490 1 item
  17. Zynq® Ultras 1 item
  18. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 20 items
  2. ETHERNET≥2 12 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 10 items
  3. SMARC 15 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 items
  3. ≤ 100 x 100mm 21 items
  4. ≤ 80 x 80mm 17 items
  5. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. Qseven 70x70 mm 7 items
  3. µQseven 70x40 3 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 43 items
  2. memory ≤16 18 items
  3. memory ≤2 44 items
  4. memory ≤4 40 items
  5. memory ≤8 32 items
  6. memory ≥32 18 items
  7. soldered down 26 items
  8. SO_DIMM 20 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 2 items
  2. CFAST slot 1 item
  3. microSD card slot 2 items
  4. onboard eMMC 22 items
  5. onboard eMMC 1 item
  6. SATA channels ≥ 1 13 items
  7. SATA channels ≥ 2 6 items
  8. SATA channels ≥ 3 1 item
  9. SD interface 17 items
  10. SD interface 1 item
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 16 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 20 items
  4. 0°C ÷ +50°C 19 items
  5. 0°C ÷ +60°C 25 items
  6. 20°C ÷ +70°C 16 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 19 items
  2. PCI-e lanes ≥ 2 13 items
  3. PCI-e lanes ≥ 3 9 items
  4. PCI-e lanes ≥ 4 10 items
  5. PCI-e lanes ≥ 5 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 20 items
  2. TTL Uarts ≥2 16 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 21 items
  2. USB 2.0 ≥ 2 21 items
  3. USB 2.0 ≥ 3 19 items
  4. USB 2.0 ≥ 4 18 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 9 items
  7. USB 3.0 ≥ 1 12 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.1 ≥ 1 6 items
  11. USB 3.1 ≥ 2 2 items
  12. USB 3.2 ≥ 1 1 item
  13. USB 3.2 ≥ 2 3 items
  14. USB CLIENT 1 item
  15. USB OTG 9 items
Video Interfaces
  1. DP 10 items
  2. DP++ 9 items
  3. DUAL CHANNEL LVDS 20 items
  4. eDP 16 items
  5. HDMI 15 items
  6. MIPI-CSI camera conn 9 items
  7. MIPI-DSI 7 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 17 items
  10. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 7 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®