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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Безвентиляторные встраиваемые компьютеры

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  1. range 10-25 W 2 items
  2. range < 10 W 3 items
Cpu Type
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  3. Intel® Core™ 3 items
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  5. NXP i.MX 93 1 item
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  2. ETHERNET≥2 9 items
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Form Factor Dimensions
  1. ≥ 100 x 100mm 3 items
Memory
  1. memory ≤1 11 items
  2. memory ≤16 4 items
  3. memory ≤2 11 items
  4. memory ≤4 9 items
  5. memory ≤8 8 items
  6. memory ≥32 4 items
  7. soldered down 8 items
  8. SO_DIMM 4 items
Mass Storage
  1. onboard SSD 1 item
  2. M.2 SATA SSD slot 4 items
  3. onboard eMMC 3 items
  4. onboard eMMC 2 items
  5. SATA channels ≥ 1 4 items
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  7. SATA channels ≥ 3 2 items
  8. SATA channels ≥ 4 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. 0°C ÷ +50°C 7 items
  4. 0°C ÷ +60°C 4 items
  5. 20°C ÷ +70°C 2 items
  6. -40°C ÷ +60°C 1 item
  7. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 3.0 ≥ 1 4 items
  4. USB 3.0 ≥ 2 3 items
  5. USB 3.1 ≥ 1 1 item
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Video Interfaces
  1. DP 4 items
  2. DP++ 3 items
  3. HDMI 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 6 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 3 items
  4. ONBOARD WI-FI/BLE 2 items