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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Безвентиляторные встраиваемые компьютеры

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Cpu Power Consumption
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Memory
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  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 2 items
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  8. SO_DIMM 2 items
Mass Storage
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  2. M.2 SATA SSD slot 3 items
  3. onboard eMMC 2 items
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  5. SATA channels ≥ 1 4 items
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Operating Temperature
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  6. -20°C ÷ +70°C 1 item
  7. -20°C ÷ +70°C 1 item
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USB
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  7. USB OTG 1 item
Video Interfaces
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  2. DP++ 2 items
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Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 2 items
  4. ONBOARD WI-FI/BLE 1 item