Menu
Account
Безвентиляторные встраиваемые компьютеры

Новейшие продукты

/images/fanless-pc/palladio-500-rpl-ai-main.jpg

Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

/images/fanless-pc/modular-link-iq-615-front.jpg

Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Безвентиляторные встраиваемые компьютеры

Shop By
Clear All
Shop By
Покупаем сейчас по
  1. Cpu Type
    Intel® Celeron®
  2. USB
    USB 2.0 ≥ 1
Clear All
Shopping Options
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M 1 item
  5. NXP i.MX 93 1 item
  6. Rockchip RK3399 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 1 item
Operating Temperature
  1. 0°C ÷ +50°C 1 item
  2. 0°C ÷ +60°C 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.2 ≥ 1 1 item
  5. USB 3.2 ≥ 2 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item
  3. M.2 Socket 2 key B 1 item