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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

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  1. Memory
    soldered down
  2. Mass Storage
    onboard eMMC
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Cpu Power Consumption
  1. range < 10 W 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Form Factor
  1. Boxed Solutions 1 item
  2. Single Board Computer 2 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. Pico-ITX 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 2 items
  3. memory ≤2 2 items
  4. memory ≤4 1 item
  5. memory ≤8 2 items
  6. soldered down 3 items
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 5 items
  3. CFAST slot 1 item
  4. M.2 SATA SSD slot 9 items
  5. microSD card slot 3 items
  6. onboard eMMC 2 items
  7. onboard eMMC 10 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 10 items
  10. SATA channels ≥ 2 3 items
  11. SATA channels ≥ 3 1 item
  12. SD interface 3 items
Operating Temperature
  1. 0°C ÷ +50°C 1 item
  2. 0°C ÷ +60°C 2 items
USB
  1. USB 2.0 ≥ 2 1 item
  2. USB 2.0 ≥ 3 1 item
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.0 ≥ 2 1 item
  5. USB OTG 1 item
Video Interfaces
  1. DP 1 item
  2. DP++ 2 items
  3. eDP 1 item
  4. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 Socket 2 key B 2 items