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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors

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SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor

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Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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Cpu Maker
  1. AMD 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range > 25 W 1 item
Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 2 items
  2. Myon MicroModule SOM 1 item
  3. Qseven 5 items
  4. SMARC 11 items
  5. Trizeps SODIMM SOM 5 items
  6. Boxed Solutions 2 items
  7. Modular HMIs 6 items
  8. Single Board Computer 1 item
  9. Single Board Computer 11 items
Form Factor Dimensions
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  2. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≥32 1 item
  2. SO_DIMM 1 item
  3. I2C EEPROM 1 item
  4. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. SATA channels ≥ 2 1 item
  3. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
Pci Express
  1. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 6 1 item
  2. USB 3.0 ≥ 4 1 item
Video Interfaces
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  2. DP 1 item
  3. DUAL CHANNEL LVDS 1 item
  4. eDP 1 item
  5. HDMI 1 item
  6. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item