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SOM-SMARC-MX952

SOM-SMARC-MX952

SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
/images/fanless-pc/palladio-500-rpl-ai-main.jpg

Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

Аппаратное обеспечение AI

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  1. USB
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Cpu Maker
  1. MediaTek 1 item
  2. NXP 1 item
Cpu Type
  1. MediaTek Genio 510 1 item
  2. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor Specification
  1. ≤ 100 x 100mm 1 item
Memory
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  2. memory ≤16 1 item
  3. memory ≤2 2 items
  4. memory ≤4 2 items
  5. memory ≤8 2 items
  6. soldered down 1 item
Mass Storage
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  2. onboard eMMC 1 item
  3. SD interface 1 item
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  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 2 items
  4. 0°C ÷ +50°C 2 items
  5. 0°C ÷ +60°C 2 items
  6. 20°C ÷ +70°C 2 items
  7. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
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  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
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  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
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  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.1 ≥ 1 1 item
  8. USB OTG 1 item
Video Interfaces
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  2. DUAL CHANNEL LVDS 3 items
  3. eDP 3 items
  4. HDMI 2 items
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  7. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items