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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS5430 processor. (E81)

Аппаратное обеспечение AI

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  6. NXP i.MX 933/935 1 item
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  2. memory ≤16 1 item
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  5. memory ≤8 4 items
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Mass Storage
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  3. -40°C ÷ +85°C 5 items
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  5. 0°C ÷ +60°C 5 items
  6. 20°C ÷ +70°C 3 items
  7. -20°C ÷ +70°C 2 items
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Wireless Connectivity
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