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Palladio 500 RPLModular embedded PC with 13th Gen Intel® Core™ processorsx86 Intel Processor Встроенные компьютеры Аппаратное обеспечение AI -
Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPSx86 Intel Processor Безвентиляторные встраиваемые компьютеры Аппаратное обеспечение AI -
Palladio 400 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processorsx86 Intel Processor Безвентиляторные встраиваемые компьютеры -
UDOO BOLT GEARBoxed solution based on AMD Embedded Ryzen V1605B Applications Processorx86 AMD Processor SBC Development Kits & Accessories Single Board Computer Development Kits for Rapid POC -
UDOO BOLTSBC based on AMD Embedded Ryzen V1000B family of Applications ProcessorAMD Processor SBC Другие форм-факторы Development Kits & Accessories Single Board Computer Other Form Factor SBC Development Kits for Rapid POC -
SBC-3.5-TGL-UP3SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)Intel Processor SBC 3.5-inch SBC