DEV-KIT-COMe-T6

Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 6 modules

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商品説明	The Development Kit contains the following material: - CCOMe-C96 Carrier Board - GPIO Header adapter cable (Free wires on one extremity) - 2x Serial Adapter Cables - 1x certified High Speed DP cable 1m - DP-to-HDMI adapter - 1x SATA cable - HDMI cable - eDP cable - Front Panel module V995 with connecting cables
ビデオインターフェース	3 x DP++ connector VGA connector LVDS 24-bit Single/ Dual Channel eDP 4-lanes 40 poles VESA connector LVDS External EDID flash socket
大容量記憶装置	4 x SATA 7p M connectors μSD Card slot (interface multiplexed with GPIO header)
ネットワーク	1x GbEthernet RJ-45 connector
USB	4x USB 3.1 Host ports on Type-A sockets 4 x USB 2.0 Host ports on Quad Type-A sockets
PCI	2x PCI-e x4 Slots 1x PCI-e x16 Slot
オーディオ	On-board HD Audio Codec (Realtek ALC888S) HD Audio Jacks S/PDIF Out Optical connector Mic In + Line Out internal pin header
シリアルポート	2 x RS-232 / RS-422 / RS-485 ports on internal pin header (from carrier board’s LPC Dual UART controller) 2 x RS-232 ports on dedicated pin header (from module)
その他のインターフェース	4 x GPI + 4 x GPO pin header (interface multiplexed with µSD slot) SPI Flash header Button / LEDs front panel header 4-pin tachometric FAN connector I2C + SM Bus on feature Pin header FuSa Header I2C Flash Socket JTAG connector LPC internal header USB overcurrent header SM Bus Smart Battery Connector 4 x 7-segment LCD displays for POST codes LPC/eSPI internal header
電源装置	ATX 24 poles connector for carrier board working only Auxiliary 12V connector for carrier board working only 12 VDC power in connector for COM Express module’s working Cabled Coin-cell connector for RTC
動作温度	0°C ÷ +60°C (Commercial version) All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final syste
寸法	305x244mm (ATXform factor, 12” x 9.6”)