SOM-COMe-CT6-R1000

AMD Ryzen™組込み型R1000シリーズのSoCを搭載したCOM Express® Rel.3.0 Compact Type 6 モジュール. (METIS - C89)

データシート

Wiki

お問い合わせ・お見積もりはこちら

お問い合わせ

CPU

AMD Ryzen™ Embedded R1000 processors

グラフィック

AMD Radeon™ Vega GPU with 3 Compute Units

接続性

4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3

メモリ

Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC Memory

製品詳細

技術情報

商品説明	Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM)
Cpu	AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.4GHz (3.3 Boost), TDP 12-25W AMD Ryzen™ Embedded R1305G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 1.5GHz (2.8 Boost), TDP 8-10W
最大コア数	2
メモリ	Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB
グラフィック	AMD Radeon™ Vega 3 GPU with 3 Compute Units DirectX® 12 supported H.265 (10-bit) decode and 8-bit video encode VP9 decode 3 independent displays supported
ビデオインターフェース	Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I eDP or Single/Dual-Channel 18-/24- bit LVDS interface (factory alternatives to third DDI port)
動画解像度	DDIs, eDP: up to 4K LVDS: up to 1920 x 1200 @ 60Hz
大容量記憶装置	2 x S-ATA Gen3 Channels
ネットワーク	Gigabit Ethernet interface Intel® I21x family GbE Controller
USB	Up to 4 x USB 3.0 Host ports 8 x USB 2.0 Host ports
PCI	2 x PCI-e x1 Gen3 lanes Additional 3rd PCI-e x1 Gen3 lane or 3x PCI-e x1 Gen2 lanes (factory alternatives) PCI-express Graphics (PEG) x4
オーディオ	HD Audio Interface
シリアルポート	2 x UARTs
その他のインターフェース	SPI, I2C, SM Bus, LPC bus, FAN management Optional TPM 2.0 module on-board 4x GPI, 4 x GPO
電源装置	+12VDC ± 10% and +5VSB (optional)
OS	Windows 10 64-bit Linux
動作温度	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
寸法	95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

ソフトウェア

リンク	SECO Technical Resources

文書化

Data Sheet	[Datasheet] SOM-COMe-CT6-R1000 Rel 1.3
Manual	[Manual] SOM-COMe-CT6-R1000 Rel 1.1
Image	[Picture] SOM-COMe-CT6-R1000_front [Picture] SOM-COMe-CT6-R1000_back

品番

グループ製品アイテム
MC89-1002-2211-C0-V	品番内容 COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp	お問い合わせ
MC89-2002-2211-C0-V	品番内容 COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 -Comm. Temp	お問い合わせ
MC89-3002-2222-C0-V	品番内容 COMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM1.2, 2xUSB3.0, 3x PCIe Gen3 - Comm. Temp	お問い合わせ
MC89-1001-1212-C0-V	品番内容 COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @ 2.6GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp	お問い合わせ
MC89-2001-1212-C0-V	品番内容 COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp	お問い合わせ