SOM-COMe-CT6-V1000

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)

工業用温度範囲で使用可能

データシート

Wiki

構成

お問い合わせ・お見積もりはこちら

お問い合わせ

CPU

AMD Ryzen™ Embedded V1000 processors

グラフィック

AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

接続性

4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3

メモリ

Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

製品詳細

技術情報

商品説明	SOM-COMe-CT6-V1000 is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
Cpu	AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 8 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range
最大コア数	4
メモリ	Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I) Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported
グラフィック	AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported H.265 (10-bit) decode and 8-bit video encode VP9 decode 4 independent displays supported
ビデオインターフェース	3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0 eDP or Single/Dual-Channel 18-/24- bit LVDS interface
動画解像度	DDIs, eDP: up to 4K LVDS: up to 1920 x 1200
大容量記憶装置	2 x S-ATA Gen3 Channels
ネットワーク	Gigabit Ethernet interface Intel® I21x family GbE Controller
USB	4 x USB 3.0 Host ports 8 x USB 2.0 Host ports
PCI	Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports PCI-express Graphics (PEG) x 8 Gen3
オーディオ	HD Audio Interface
シリアルポート	2 x UARTs
その他のインターフェース	SPI, I2C bus, SM Bus, LPC bus, FAN management LID#/SLEEP#/PWRBTN#, Watchdog 4x GPI, 4 x GPO Optional TPM 1.2 module on-board
電源装置	+12VDC ± 10% and + 5VSB (optional)
OS	Microsoft® Windows 10 Linux
動作温度	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
寸法	95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

ソフトウェア

リンク	SECO Technical Resources

文書化

Data Sheet	[Datasheet] SOM-COMe-CT6-V1000 Rel 1.8
Manual	[Manual] CHARON Rel 1.1
Image	[Picture] CHARON_front [Picture] CHARON_back

品番

グループ製品アイテム
MB75-4001-2111-C1-V	品番内容 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp	お問い合わせ
CHARON	品番内容 AMD Ryzen™組込み型R1000シリーズのSoCを搭載したCOM Express® Rel.3.0 Compact Type 6 モジュール	お問い合わせ
MB75-9001-1211-I1-V	品番内容 COMe-B75-CT6 w/AMD Ryzen Embedded V1404I @ 2GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Ind. Temp	お問い合わせ