SOM-COMe-CT6-Snapdragon-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Snapdragon X / X Plus / X Elite line of processors in SiP-A, with Qualcomm Hexagon NPU, up to 45 TOPS

Disponibile nell'intervallo di temperatura industriale

Data sheet

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Cpu

Qualcomm Snapdragon X / X Plus / X Elite line of processors in SiP-A, with Qualcomm Hexagon NPU, up to 45 TOPS

Grafica

Qualcomm® Adreno™ GPU • X1E-78-100 and X1P-64-100: Up to 3.8 TFLOPS • X1P-42-100 and X1-26-100: Up to 1.7 TFLOPS

Connettività

1x NBase-T Ethernet port

Memoria

Up to 64GB LPDDR5 4224MT/s integrated on SiP

Dettagli Prodotto

Informazioni tecniche

Descrizione	COM Express 3.1 Type 6 Compact modules with Qualcomm Snapdragon X / X Plus / X Elite line of processors in SiP-A, with Qualcomm Hexagon NPU, up to 45 TOPS
Cpu	Qualcomm Snapdragon X / X Plus / X Elite line of processors in SiP-A , with Qualcomm Hexagon NPU, up to 45 TOPS • Snapdragon X X1-26-100: 8 Cores Qualcomm® Oryon™ CPU @ 3.0 GHz, 30MB Cache • Snapdragon X Plus X1P-42-100: 8 Cores Qualcomm® Oryon™ CPU @ 3.2 GHz (3.4GHz Single Core Boost), 30MB Cache • Snapdragon X Plus X1P-64-100: 10 Cores Qualcomm® Oryon™ CPU @ 3.4 GHz, 42MB Cache • Snapdragon X Elite X1E-78-100: 12 Cores Qualcomm® Oryon™ CPU @ 3.4 GHz, 42MB Cache
Memoria	Up to 64GB LPDDR5 4224MT/s integrated on SiP
Grafica	Qualcomm® Adreno™ GPU • X1E-78-100 and X1P-64-100: Up to 3.8 TFLOPS • X1P-42-100 and X1-26-100: Up to 1.7 TFLOPS
Interfacce video	Up to 4 independent displays 2x DP supporting DP / DP Alt Mode overType-C 1x DDI supporting DP 1x eDP or 1 x LVDS Single/Dual Channel interfaces (factory alternatives)
Risoluzione video	DP: up to 5120x2880 @60Hz eDP up to 4K60Hz LVDS up to 1920x1200 @ 60Hz Max resolution 5120 × 2880p60 + 4096 × 2160p60 + 4096 × 2160p60 across all display outputs.
Memoria di massa	UFS 4.0 module on-board, optional, up to 256GB microSD card slot I2C EEPROM
Rete	1x NBase-T Ethernet port with Time-Sensitive Networking, supporting 10/100/1000/2500Mbps Intel® I226 Ethernet Controller
USB	2x USB 10Gbps interfaces (without USB hub) 1x USB 10Gbps + 3xUSB 5Gbps (with USB hub) 8x Hi-Speed USB 2x USB4 Gen3x2 ports
Pci	2x PCI-e x2 or 1x PCI-e x4 Gen4 port 1x PCI-e x2 Gen3 lport 1x PCI-e x8 Gen4 port on PEG pins
Audio	I2S audio interface on pins demanded to HD audio Soundwire interface
Porte seriali	Up to 2x 2-wires UARTs CAN port (optional)
Altre interfacce	Boot SPI General purpose SPI QSPI on LPC/eSPI 2x I2C Bus 4x GPIs 4x GPOs
Dispositivo di alimentazione	+12VDC ± 10%, +5V StandBy, +3.0VRTC
Sistema operativo	Microsoft® Windows 11 IoT Enterprise
Temperatura operativa	0° ÷ +60°C (Commercial Version) -40C ÷ +85°C (Industrial Version)
Dimensioni	95x95mm (COM Express Compact Form Factor)