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SOM-COM-HPC-A-ARLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E87) -
SOM-COMe-BT6-ARLCOM Express Rel. 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E59) -
SOM-COMe-CT6-ADL-NCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Alder Lake N). (E90) -
SOM-COMe-CT6-ASLCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Amston Lake). (E90) -
SOM-COMe-BT6-MTLCOM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U) -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U) -
Palladio 400 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
Palladio 500 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80) -
Titan 300 TGL-UP3 AIOrdinateur embarqué sans ventilateur avec les processeurs Intel® Core™ de 11ème génération et les SoCs Intel® Celeron® (Codename: Tiger Lake UP3) ainsi que la puce d'IA Axelera : alimenté par un seul Metis AIPU jusqu'à 120 TOPS
