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Processeur Qualcomm

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SOM-COMe-CT6-Dragonwing-IQ9

SOM-COMe-CT6-Dragonwing-IQ9

COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)

SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/fanless-pc/modular-link-iq-615-front.jpg

Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

Processeur Qualcomm

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Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 2 items
  4. range > 25 W 1 item
Cpu Type
  1. NXP i.MX 93 1 item
  2. Qualcomm Snapdragon 1 item
  3. Qualcomm® QCS5430 1 item
  4. Qualcomm® QCS6490 4 items
  5. Qualcomm Dragonwing IQ-X 1 item
  6. Qualcomm Dragonwing 1 item
  7. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 6 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 2 items
  2. Myon MicroModule SOM 1 item
  3. SMARC 4 items
  4. Boxed Solutions 1 item
  5. Modular HMIs 2 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. ≤ 100 x 100mm 3 items
  3. ≥ 100 x 100mm 2 items
  4. COM Express® 2 items
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 3 items
  4. memory ≤8 2 items
  5. soldered down 6 items
  6. memory ≤32 1 item
  7. UFS 3.1 module on-board 1 item
  8. I2C EEPROM 2 items
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mounting Option
  1. VESA Mount 2 items
  2. Rear Mount 2 items
  3. Panel Mount 2 items
  4. Flush Mount 2 items
Mass Storage
  1. soldered down 1 item
  2. I2C EEPROM 1 item
  3. onboard eMMC 2 items
  4. onboard eMMC 5 items
  5. SD interface 1 item
  6. SD interface 5 items
  7. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  8. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 8 items
  5. 20°C ÷ +70°C 2 items
  6. -40°C ÷ +60°C 1 item
  7. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
  4. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 1 item
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.0 ≥ 4 1 item
  10. USB 3.1 ≥ 1 4 items
  11. USB CLIENT 2 items
  12. USB OTG 1 item
Video Interfaces
  1. DP 5 items
  2. DUAL CHANNEL LVDS 4 items
  3. eDP 3 items
  4. HDMI 1 item
  5. MIPI-CSI camera conn 3 items
  6. MIPI-DSI 4 items
  7. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 2 items
  3. /s/n/snapdragon-x_per_sito.jpg 1 item