SOM-COM-HPC-A-MTL
Détails produit
Description | COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U) |
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Cpu | Intel® Core™ Ultra Processors Family (codename: Meteor Lake-H) - 20/28/65W base power:
Intel® Core™ Ultra Processors Family (codename: Meteor Lake-U) - 12/15/28W Base Power:
|
Mémoire | Two DDR5 SO-DIMM slot supporting DDR5-5600 IBECC* modules, up to 64GB (*) IBECC: In-Band Error-Correcting Code Memory |
Graphiques | Integrated Intel® Xe LPG graphics controller with up to 8 Xe cores (128 EU) Support up to 4 independent displays |
Interfaces vidéo | 2x Digital Display Interfaces (DDIs) supporting DP, HDMI®, DP Alt-Mode over Type-C 1x DDI Interface supporting DP / HDMI® / eDP 1x eDP interface |
Résolution vidéo | HDMI®: up to 8K60 according to HDMI® 2.1 DP 2.1: up to 8K60Hz / 5K120Hz eDP 1.4b: up to 4K120Hz HDR Max resolution 4x4K60Hz |
Stockage masse | Up to 2x S-ATA Gen3.2 channels Optional NVMe SSD (PCIE-e x4 interface) soldered on-board, up to 512GB |
Réseau | Up to 2x NBase-T ethernet interfaces with Intel® I226 GbE controller, supporting 2.5GbE and TSN |
Usb | 2x USB 10Gbps interfaces 2x USB 20Gbps/40Gbps interfaces 8x Hi-Speed USB ports |
Pci | Up to 7x PCI-e x1 Gen4 lanes (4x groupable) Up to 3x PCI-e x4 Gen4 ports 1x PCI-e x8 Gen5 port (-H Series processors only) Max 9 root ports supported |
Audio | HD Audio interface 2x SoundWire Interface |
Ports sériels | 2x 4-wires UARTs |
Autres Interfaces | Boot SPI + GP SPI, 2x I2C, SM Bus, thermal management, FAN management eSPI interface Optional TPM 1.2/2.0 on-board Power and system management signals Watchdog 12x GPIO 2x MIPI-CSI-2 4-lane camera interfaces |
Alimentation | +12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
Système d’exploitation | Microsoft® Windows 11 IoT Enterprise 2019 Clea OS (Linux Yocto) |
Température de fonctionnement | 0°C ÷ +60°C (Commercial version) *
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions | 120 x 95 mm (COM-HPC® Size A Form factor, Client pinout) |
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