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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC basado en el procesador de aplicaciones Intel® Celeron® y Pentium®.

UDOO VISION

UDOO VISION

Ordenador monoplaca Pico-ITX con procesadores Intel® Atom® Serie X, Intel® Celeron® Serie N, Intel® Pentium® Serie N (codename: Apollo Lake)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computadora embebida sin ventilador con los procesadores Intel® Core™ de 11ª generación y los Intel® Celeron® SoCs (Codename: Tiger Lake UP3) más el chip de inteligencia artificial Axelera: alimentado por un solo Metis AIPU de hasta 120 TOPS

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Cpu Power Consumption
  1. range 10-25 W 12 items
  2. range < 10 W 11 items
  3. range > 25 W 3 items
Cpu Type
  1. Intel® Atom™ 14 items
  2. Intel® Celeron® 16 items
  3. Intel® Core™ 15 items
  4. Intel® Pentium® 10 items
  5. Intel® Xeon® 2 items
Ethernet
  1. ETHERNET≥1 24 items
  2. ETHERNET≥2 10 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 5 items
  3. Qseven 3 items
  4. Single Board Compute 1 item
  5. SMARC 3 items
  6. Single Board Computer 1 item
  7. Single Board Computer 3 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 14 items
  3. ≤ 80 x 80mm 5 items
  4. ≥ 100 x 100mm 4 items
  5. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 6 items
  2. COM Express Compact 6 items
  3. COM-HPC Client 4 items
  4. embedded NUC 1 item
  5. Other SBCs 2 items
  6. Pico-ITX 2 items
  7. Qseven 70x70 mm 3 items
Memory
  1. memory ≤1 18 items
  2. memory ≤16 11 items
  3. memory ≤2 19 items
  4. memory ≤4 19 items
  5. memory ≤8 22 items
  6. memory ≥32 9 items
  7. soldered down 11 items
  8. SO_DIMM 15 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 3 items
  3. standard SATA connector 4 items
  4. CFAST slot 1 item
  5. M.2 NVMe SSD slot 5 items
  6. M.2 SATA SSD slot 8 items
  7. microSD card slot 7 items
  8. onboard eMMC 2 items
  9. onboard eMMC 12 items
  10. onboard eMMC 2 items
  11. SATA channels ≥ 1 19 items
  12. SATA channels ≥ 2 15 items
  13. SATA channels ≥ 2 1 item
  14. SATA channels ≥ 2 3 items
  15. SATA channels ≥ 3 3 items
  16. SATA channels ≥ 4 1 item
  17. SD interface 6 items
Operating Temperature
  1. -20°C ÷ +60°C 12 items
  2. -40°C ÷ +85°C 18 items
  3. 0°C ÷ +50°C 17 items
  4. 0°C ÷ +60°C 24 items
  5. 20°C ÷ +70°C 12 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 19 items
  2. PCI-e lanes ≥ 2 19 items
  3. PCI-e lanes ≥ 3 18 items
  4. PCI-e lanes ≥ 4 15 items
  5. PCI-e lanes ≥ 5 13 items
Ttl Uarts
  1. TTL Uarts ≥1 16 items
  2. TTL Uarts ≥2 16 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 21 items
  2. USB 2.0 ≥ 2 20 items
  3. USB 2.0 ≥ 3 20 items
  4. USB 2.0 ≥ 4 20 items
  5. USB 2.0 ≥ 5 18 items
  6. USB 2.0 ≥ 6 17 items
  7. USB 3.0 ≥ 1 16 items
  8. USB 3.0 ≥ 2 13 items
  9. USB 3.0 ≥ 3 11 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 7 items
  12. USB 3.1 ≥ 2 7 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 5 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 1 item
  20. USB OTG 4 items
Video Interfaces
  1. DDI 15 items
  2. DP 19 items
  3. DP++ 26 items
  4. DUAL CHANNEL LVDS 22 items
  5. eDP 29 items
  6. HDMI 29 items
  7. MIPI-CSI camera conn 8 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 20 items
  11. VGA 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 Socket 2 key B 2 items
  3. ONBOARD WI-FI/BLE 2 items