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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. Cpu Maker
    NXP
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Cpu Maker
  1. AMD 7 items
  2. Intel 25 items
  3. MediaTek 2 items
  4. NXP 16 items
  5. Qualcomm 6 items
  6. Rockchip 1 item
Cpu Power Consumption
  1. range < 10 W 6 items
  2. range < 5 W 5 items
Cpu Type
  1. NXP i.MX 8M 3 items
  2. NXP i.MX 8M Mini 3 items
  3. NXP i.MX 8M Nano 2 items
  4. NXP i.MX 8M Plus 2 items
  5. NXP i.MX 8X 1 item
  6. NXP i.MX 933/935 1 item
  7. NXP i.MX 95 1 item
  8. NXP i.MX6 4 items
  9. NXP i.MX8 1 item
Ethernet
  1. ETHERNET≥1 13 items
  2. ETHERNET≥2 5 items
Form Factor
  1. Myon MicroModule SOM 1 item
  2. Qseven 6 items
  3. SMARC 5 items
  4. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 items
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 4 items
  5. ≤ 100 x 100mm 8 items
  6. ≤ 80 x 80mm 8 items
Form Factor Specification
  1. Qseven 70x70 mm 3 items
  2. µQseven 70x40 3 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 15 items
  2. memory ≤16 1 item
  3. memory ≤2 15 items
  4. memory ≤4 12 items
  5. memory ≤8 5 items
  6. soldered down 9 items
Mass Storage
  1. onboard SSD 1 item
  2. microSD card slot 2 items
  3. onboard eMMC 15 items
  4. onboard eMMC 1 item
  5. SATA channels ≥ 1 2 items
  6. SD interface 9 items
  7. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 8 items
  2. -40°C ÷ +85°C 15 items
  3. 0°C ÷ +50°C 8 items
  4. 0°C ÷ +60°C 11 items
  5. 20°C ÷ +70°C 8 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 11 items
  2. PCI-e lanes ≥ 2 3 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 13 items
  2. TTL Uarts ≥2 12 items
  3. TTL Uarts ≥3 9 items
USB
  1. USB 2.0 ≥ 1 13 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 7 items
  4. USB 2.0 ≥ 4 7 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 7 items
  8. USB 3.0 ≥ 2 5 items
  9. USB OTG 11 items
Video Interfaces
  1. DP 2 items
  2. DUAL CHANNEL LVDS 11 items
  3. eDP 3 items
  4. HDMI 9 items
  5. MIPI-CSI camera conn 2 items
  6. MIPI-DSI 7 items
  7. PARALLEL RGB 3 items
  8. SINGLE CHANNEL LVDS 12 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 6 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®