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SOM-Q7-MX8M
Qseven® Rel. Módulo 2.1 con procesadores de aplicaciones NXP i.MX 8M.
(MIRA - C25)
Cpu
NXP i.MX 8M Applications Processors
Gráficas
Integrated GPU, supports 2 independent displays
Conectividad
1x USB 3.0; 4x USB2.0; up to 2x PCI-e x1 Gen2; 1x CAN Bus; 2x UART; 8x GPI/Os
Memoria
up to 4GB soldered down DDR4-2400 memory
Datos del producto
Descripción
|
MIRA is a Qseven® Rel. 2.1 compliant Computer on Module (CoM) based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. MIRA is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia. |
|---|---|
Cpu
|
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor: |
|
Memoria
|
soldered down DDR4-2400 memory, 32-bit interface, up to 4GB |
|
Gráfica
|
Integrated Graphics Processing Unit, supports 2 independent displays. |
Interfaces vídeos
|
HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3 |
Resolución vídeo
|
HDMI/DP Up to 4096 x 2160p60 LVDS/eDP Up to 1920 x 1080 @ 60Hz |
Almacenamiento en masa
|
eMMC 5.0 drive soldered on-board, up to 64GB |
Trabajo en red
|
1 x Gigabit Ethernet interface |
Usb
|
1 x USB 3.0 Host or Client Port |
|
Pci
|
Up to 2 x PCI-e x1 Gen2 ports |
Audio
|
I2S Audio Interface |
Puertos de serie
|
1x UART Tx/Rx/RTS/CTS (Optional) |
Otras interfaces
|
I2C Bus |
Alimentación eléctrica
|
+5VDC ±5% and +5VSB (optional) |
Sistema operativo
|
Linux |
Temperatura de funcionamiento
|
0°C ÷ +60°C (Commercial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensiones
|
70x70 mm (2.76” x 2.76”) |
| QC25-2340-3331-C2-V | Descripción número de pieza Q7-C25 w/i.MX8M Quad 1.5GHz, 4GB DDR4 RAM, 32GB eMMC, 1x HDMI/DP, 1x LVDS, 4xUSB 2.0, 2xPCIe, CAN, 1x UART, SPI, - Comm. Temp. | |
| QC25-5340-3331-I2-V | Descripción número de pieza Q7-C25 w/i.MX8M Quad 1.3GHz, 4GB DDR4 RAM, 32GB eMMC, 1x HDMI/DP, 1x LVDS, 4xUSB 2.0, 2xPCIe, CAN, 1x UART, SPI, - Ind. Temp. | |
| QC25-8110-3311-C2-V | Descripción número de pieza Q7-C25 w/i.MX8M Dual 1.5GHz, 1GB DDR4 RAM, 4GB eMMC, 1x HDMI/DP, 1x LVDS, 4xUSB 2.0, CAN, 1x UART, SPI, - Comm. Temp. | |
| QC25-8230-3331-C2-V | Descripción número de pieza Q7-C25 w/i.MX8M Dual 1.5GHz, 2GB DDR4 RAM, 16GB eMMC, 1x HDMI/DP, 1x LVDS, 4xUSB 2.0, 2xPCIe, CAN, 1x UART, SPI, - Comm. Temp. | |
| QC25-A110-3311-I2-V | Descripción número de pieza Q7-C25 w/i.MX8M Dual 1.3GHz, 1GB DDR4 RAM, 4GB eMMC, 1x HDMI/DP, 1x LVDS, 4xUSB 2.0, CAN, 1x UART, SPI, - Ind. Temp. | |
| QC25-A230-3331-I2-V | Descripción número de pieza Q7-C25 w/i.MX8M Dual 1.3GHz, 2GB DDR4 RAM, 16GB eMMC, 1x HDMI/DP, 1x LVDS, 4xUSB 2.0, 2xPCIe, CAN, 1x UART, SPI, - Ind. Temp. |
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