ES
DE 
EN - € 
FR 
IT 
JP 
USA 
ZH 
SOM-uQ7-MX6-2
Módulo μQseven® con procesadores NXP i.MX 6
(NEMBUS - A75)
Cpu
Single and Dual Core Lite (ARM Cortex™A9 Cores)
Gráficas
2D/3D dedicated graphics processors
Conectividad
FastEthernet; GPI/Os
Memoria
up to 1GB DDR3L on-board
Datos del producto
Descripción
|
The extremely low power and low cost μQseven Rev. 2.0 Compliant Computer on Module (CoM) with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support. |
|---|---|
Cpu
|
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors - i.MX6S Solo - Single core up to 1GHz |
|
Núcleos máx.
|
2 |
|
Memoria
|
Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F |
|
Gráfica
|
Dedicated 2D Hardware accelerator |
Interfaces vídeos
|
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface |
Resolución vídeo
|
LVDS, resolution up to 1920x1200 |
Almacenamiento en masa
|
On-board eMMC drive, up to 8 GB |
Trabajo en red
|
Fast Ethernet (10/100) interface |
Usb
|
1 x USB OTG interface |
|
Pci
|
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported) |
Audio
|
I2S / AC’97 Audio Interface |
Otras interfaces
|
On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities: (*) not all the combinations are allowed simultaneously Power Management Signals |
Alimentación eléctrica
|
+5VDC ± 5% |
Sistema operativo
|
Linux |
Temperatura de funcionamiento
|
0°C ÷ +60 °C (commercial temp.)*
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensiones
|
40x70 mm (1.57” x 2.76”) |
| QA75-1140-1000-C0-V | Descripción número de pieza µQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Comm.Temp | |
| QA75-1140-1000-I0-V | Descripción número de pieza µQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Ind.Temp | |
| QA75-1340-1000-I0-V | Descripción número de pieza µQ7 - µQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Comm.Temp | |
| QA75-2330-1000-C0-V | Descripción número de pieza µQ7 - µQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 512MB dual chip - eMMC 4GB - RTC Low Power - Comm.Temp | |
| QA75-2410-1000-C0-V | Descripción número de pieza µQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 1GB dual chip - eMMC 4GB - RTC Low Power - Comm.Temp | |
| QA75-2440-1000-I0-V | Descripción número de pieza µQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 1GB dual chip - eMMC 4GB - RTC Low Power - Ind.Temp |
Accessories
¿No encontró la solución que buscaba?
¿El producto estándar no satisface sus necesidades? SECO puede colaborar para desarrollar juntos una solución de software y un hardware personalizado total o parcialmente.
Para saber más
